Fabrication of multilayered film of polyimide nanoparticles for low-k applications

Gufan Zhao, Takayuki Ishizaka, Hitoshi Kasai, Hidetoshi Oikawa, Hachiro Nakanishi

Research output: Contribution to conferencePaper

Abstract

In order to reduce dielectric constant of polyimide, preparation of porous films assembled by polyimide nanoparticles was investigated. We utilized the electrodeposition of polyimide nanoparticles to prepare porous low-k films possessing voids between particles. The film morphology can be controlled by changing electrical potential and dispersion concentration of polyimide nanoparticles. Dielectric properties of porous films obtained will be discussed. Moreover, fabrication of porous polyimide nanoparticles was also studied.

Original languageEnglish
Pages3815-3816
Number of pages2
Publication statusPublished - 2006 Dec 1
Event55th Society of Polymer Science Japan Symposium on Macromolecules - Toyama, Japan
Duration: 2006 Sep 202006 Sep 22

Other

Other55th Society of Polymer Science Japan Symposium on Macromolecules
CountryJapan
CityToyama
Period06/9/2006/9/22

Keywords

  • Electrodeposition
  • Low-k
  • Multilayered film
  • Polyimide
  • Porous nanoparticle
  • Reprecipitation

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Zhao, G., Ishizaka, T., Kasai, H., Oikawa, H., & Nakanishi, H. (2006). Fabrication of multilayered film of polyimide nanoparticles for low-k applications. 3815-3816. Paper presented at 55th Society of Polymer Science Japan Symposium on Macromolecules, Toyama, Japan.