TY - JOUR
T1 - Fabrication of MOSFET capacitive sensor using spray coating method
AU - Aoyagi, Seiji
AU - Matsui, Yuichi
AU - Makihira, Kenji
AU - Tokunaga, Hiroshi
AU - Sasaki, Minoru
AU - Hane, Kazuhiro
N1 - Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2007
Y1 - 2007
N2 - A capacitive MOSFET sensor using a SOI wafer for detecting vertical force applied to its floating gate is herein proposed. A MOSFET is fabricated on a SOI wafer, and the box oxide under the gate is removed to release the gate structure. This sensor detects the displacement of the movable gate electrode from changes in drain current, and this current can be amplified electrically by adding voltage to the gate, i.e., the MOSFET itself serves as a mechanical sensor structure. By using a SOI wafer having a thick active silicon layer, a thick gate structure is made possible, which increases the mechanical stiffness and durability, and increases the sensitivity in accclerometer application by weighting a proof mass. During the fabrication process of this sensor, it is necessary that photoresist be coated on the top-surface and sidewall of the vertical pillar structure with a high aspect ratio. To address this problem, photoresist is applied using spray coating. The uniform coating is successfully realized by adjusting the moving speed of the substrate, and the substrate temperature. A practical test device is under development using this method, and aluminum electrodes for drain, source and gate areas are successfully patterned.
AB - A capacitive MOSFET sensor using a SOI wafer for detecting vertical force applied to its floating gate is herein proposed. A MOSFET is fabricated on a SOI wafer, and the box oxide under the gate is removed to release the gate structure. This sensor detects the displacement of the movable gate electrode from changes in drain current, and this current can be amplified electrically by adding voltage to the gate, i.e., the MOSFET itself serves as a mechanical sensor structure. By using a SOI wafer having a thick active silicon layer, a thick gate structure is made possible, which increases the mechanical stiffness and durability, and increases the sensitivity in accclerometer application by weighting a proof mass. During the fabrication process of this sensor, it is necessary that photoresist be coated on the top-surface and sidewall of the vertical pillar structure with a high aspect ratio. To address this problem, photoresist is applied using spray coating. The uniform coating is successfully realized by adjusting the moving speed of the substrate, and the substrate temperature. A practical test device is under development using this method, and aluminum electrodes for drain, source and gate areas are successfully patterned.
KW - FET sensor
KW - High aspect ratio pillar
KW - MOSFET sensor
KW - SOI wafer
KW - Spray coating of photoresist
KW - Vertical sidewall
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U2 - 10.1541/ieejsmas.127.153
DO - 10.1541/ieejsmas.127.153
M3 - Article
AN - SCOPUS:33847775028
SN - 1341-8939
VL - 127
SP - 153-159+9
JO - IEEJ Transactions on Sensors and Micromachines
JF - IEEJ Transactions on Sensors and Micromachines
IS - 3
ER -