Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation

So Ikeda; Michitaka Yamamoto; Eiji Higurashi; Tadatomo Suga; Toshiaki Oguchi

doi:10.1109/LTB-3D.2014.6886175

Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation

So Ikeda, Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Toshiaki Oguchi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An ultra-small polarization sensor integrated with aluminum wire-grid polarizers has been developed for a compact optical rotary encoder. Flip-chip bonding using atmospheric-pressure plasma activation with mixed gas of Ar and H₂ at a relatively low bonding temperature of 150 °C was applied to fabricate the integrated sensors. The feasibility of rotational angle measurement of a linear polarizer was demonstrated using the fabricated sensors.

Original language	English
Title of host publication	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Publisher	IEEE Computer Society
Pages	36
Number of pages	1
ISBN (Print)	9781479952618
DOIs	https://doi.org/10.1109/LTB-3D.2014.6886175
Publication status	Published - 2014
Externally published	Yes
Event	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan Duration: 2014 Jul 15 → 2014 Jul 16

Publication series

Name	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Other

Other	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Country/Territory	Japan
City	Tokyo
Period	14/7/15 → 14/7/16

ASJC Scopus subject areas

Filtration and Separation

Access to Document

10.1109/LTB-3D.2014.6886175

Cite this

Ikeda, S., Yamamoto, M., Higurashi, E., Suga, T., & Oguchi, T. (2014). Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 (pp. 36). [6886175] (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886175

Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation. / Ikeda, So; Yamamoto, Michitaka; Higurashi, Eiji et al.

Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 2014. p. 36 6886175 (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ikeda, S, Yamamoto, M, Higurashi, E, Suga, T & Oguchi, T 2014, Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation. in Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014., 6886175, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, IEEE Computer Society, pp. 36, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan, 14/7/15. https://doi.org/10.1109/LTB-3D.2014.6886175

Ikeda S, Yamamoto M, Higurashi E, Suga T, Oguchi T. Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society. 2014. p. 36. 6886175. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). doi: 10.1109/LTB-3D.2014.6886175

Ikeda, So ; Yamamoto, Michitaka ; Higurashi, Eiji et al. / Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation. Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 2014. pp. 36 (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

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abstract = "An ultra-small polarization sensor integrated with aluminum wire-grid polarizers has been developed for a compact optical rotary encoder. Flip-chip bonding using atmospheric-pressure plasma activation with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C was applied to fabricate the integrated sensors. The feasibility of rotational angle measurement of a linear polarizer was demonstrated using the fabricated sensors.",

author = "So Ikeda and Michitaka Yamamoto and Eiji Higurashi and Tadatomo Suga and Toshiaki Oguchi",

year = "2014",

doi = "10.1109/LTB-3D.2014.6886175",

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AB - An ultra-small polarization sensor integrated with aluminum wire-grid polarizers has been developed for a compact optical rotary encoder. Flip-chip bonding using atmospheric-pressure plasma activation with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C was applied to fabricate the integrated sensors. The feasibility of rotational angle measurement of a linear polarizer was demonstrated using the fabricated sensors.

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Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation

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