Fabrication of microprobes on a ultrathick glass substrate with narrow-pitch electrical feedthroughs for next-generation LSI burn-in tests

Shuji Tanaka, S. Fujimoto, O. Ito, S. H. Choe, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper describes microprobes fabricated on a thick glass substrate with narrow-pitch electrical feedthroughs for the application to the next-generation LSI burn-in test. The feedthrough glass substrate was sliced off from the block of stacked Pyrex glass substrates with thin metal lines. The pitch of the feedthroughs in one direction is defined by photolithography, and thus can be made sufficiently small. The probes were made of heavily-boron-diffused silicon, and fixed on the feedthrough glass substrate by anodic bonding. The feedthrough glass substrate was evaluated in terms of the resistance of the feedthroughs. The probes were evaluated in terms of mechanical robustness against overdrive.

Original languageEnglish
Title of host publicationMEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
Pages347-350
Number of pages4
DOIs
Publication statusPublished - 2008 Aug 29
Event21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson - Tucson, AZ, United States
Duration: 2008 Jan 132008 Jan 17

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
CountryUnited States
CityTucson, AZ
Period08/1/1308/1/17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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    Tanaka, S., Fujimoto, S., Ito, O., Choe, S. H., & Esashi, M. (2008). Fabrication of microprobes on a ultrathick glass substrate with narrow-pitch electrical feedthroughs for next-generation LSI burn-in tests. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems (pp. 347-350). [4443664] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2008.4443664