A new lost-mold process to fabricate piezoceramic microrods for 1-3 piezocomposites has been developed. A Si wafer was machined as a mold with a regular array of columnar cavities having a negative structure of piezoceramic microrods, by deep reactive ion etching (RIE). A lead zirconate titanate (PZT) slurry was cast into the Si mold and calcinated to burn out the binder, and fully condensed in the cavities by the glass-encapsulated hot isostatic pressing technique. Finally, the Si mold was selectively removed by XeF 2 etching. PZT microrods with high aspect ratios (diameter <12 μm, aspect ratio >14), which can be used to construct high-resolution micro-ultrasonic transducers for medical imaging, were fabricated successfully by the present process.
|Number of pages||3|
|Journal||Journal of the American Ceramic Society|
|Publication status||Published - 1999 Dec 1|
ASJC Scopus subject areas
- Ceramics and Composites
- Materials Chemistry