Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding

Hironori Tohmyoh; Hironao Takeda; Mohammed N.I. Khan; Masumi Saka

doi:10.1109/ESIME.2010.5464556

Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding

Hironori Tohmyoh, Hironao Takeda, Mohammed N.I. Khan, Masumi Saka

ENG - Finemechanics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

A very-thin Pt/W thermoelectric element is fabricated on a small chip. The Pt and W thin wires having the diameter of 5 μm are attached on a Cu electrode chip, and these are electrically isolated by air grove on the chip. The tips of both thin wires are welded by the technique of Joule heating. The other ends of wires are connected to a voltmeter. Temperature of the constructed electro-thermal circuit is controlled by flowing of the current through the circuit. The observed voltage is found to be proportional to the temperature difference between the dissimilar welding point and the chip (room temperature) which satisfies the Seebeck effect. The Seebeck coefficient is found to be about 0.2 μV/K. The temperature distribution of 5 μm Pt wire, where the constant current is flowing, is successfully measured by the fabricated very-thin Pt/W thermoelectric element.

Original language	English
Title of host publication	2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
DOIs	https://doi.org/10.1109/ESIME.2010.5464556
Publication status	Published - 2010 Jun 24
Event	2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 - Bordeaux, France Duration: 2010 Apr 26 → 2010 Apr 28

Publication series

Name	2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Other

Other	2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Country	France
City	Bordeaux
Period	10/4/26 → 10/4/28

ASJC Scopus subject areas

Computational Theory and Mathematics
Electrical and Electronic Engineering
Theoretical Computer Science

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10.1109/ESIME.2010.5464556

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Tohmyoh, H., Takeda, H., Khan, M. N. I., & Saka, M. (2010). Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding. In 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 [5464556] (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010). https://doi.org/10.1109/ESIME.2010.5464556

Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding. / Tohmyoh, Hironori; Takeda, Hironao; Khan, Mohammed N.I.; Saka, Masumi.

2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 2010. 5464556 (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Tohmyoh, H, Takeda, H, Khan, MNI & Saka, M 2010, Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding. in 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010., 5464556, 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, Bordeaux, France, 10/4/26. https://doi.org/10.1109/ESIME.2010.5464556

Tohmyoh H, Takeda H, Khan MNI, Saka M. Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding. In 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 2010. 5464556. (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010). https://doi.org/10.1109/ESIME.2010.5464556

Tohmyoh, Hironori ; Takeda, Hironao ; Khan, Mohammed N.I. ; Saka, Masumi. / Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 2010. (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010).

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abstract = "A very-thin Pt/W thermoelectric element is fabricated on a small chip. The Pt and W thin wires having the diameter of 5 μm are attached on a Cu electrode chip, and these are electrically isolated by air grove on the chip. The tips of both thin wires are welded by the technique of Joule heating. The other ends of wires are connected to a voltmeter. Temperature of the constructed electro-thermal circuit is controlled by flowing of the current through the circuit. The observed voltage is found to be proportional to the temperature difference between the dissimilar welding point and the chip (room temperature) which satisfies the Seebeck effect. The Seebeck coefficient is found to be about 0.2 μV/K. The temperature distribution of 5 μm Pt wire, where the constant current is flowing, is successfully measured by the fabricated very-thin Pt/W thermoelectric element.",

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AU - Tohmyoh, Hironori

AU - Takeda, Hironao

AU - Khan, Mohammed N.I.

AU - Saka, Masumi

PY - 2010/6/24

Y1 - 2010/6/24

N2 - A very-thin Pt/W thermoelectric element is fabricated on a small chip. The Pt and W thin wires having the diameter of 5 μm are attached on a Cu electrode chip, and these are electrically isolated by air grove on the chip. The tips of both thin wires are welded by the technique of Joule heating. The other ends of wires are connected to a voltmeter. Temperature of the constructed electro-thermal circuit is controlled by flowing of the current through the circuit. The observed voltage is found to be proportional to the temperature difference between the dissimilar welding point and the chip (room temperature) which satisfies the Seebeck effect. The Seebeck coefficient is found to be about 0.2 μV/K. The temperature distribution of 5 μm Pt wire, where the constant current is flowing, is successfully measured by the fabricated very-thin Pt/W thermoelectric element.

AB - A very-thin Pt/W thermoelectric element is fabricated on a small chip. The Pt and W thin wires having the diameter of 5 μm are attached on a Cu electrode chip, and these are electrically isolated by air grove on the chip. The tips of both thin wires are welded by the technique of Joule heating. The other ends of wires are connected to a voltmeter. Temperature of the constructed electro-thermal circuit is controlled by flowing of the current through the circuit. The observed voltage is found to be proportional to the temperature difference between the dissimilar welding point and the chip (room temperature) which satisfies the Seebeck effect. The Seebeck coefficient is found to be about 0.2 μV/K. The temperature distribution of 5 μm Pt wire, where the constant current is flowing, is successfully measured by the fabricated very-thin Pt/W thermoelectric element.

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