TY - GEN
T1 - Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding
AU - Tohmyoh, Hironori
AU - Takeda, Hironao
AU - Khan, Mohammed N.I.
AU - Saka, Masumi
PY - 2010/6/24
Y1 - 2010/6/24
N2 - A very-thin Pt/W thermoelectric element is fabricated on a small chip. The Pt and W thin wires having the diameter of 5 μm are attached on a Cu electrode chip, and these are electrically isolated by air grove on the chip. The tips of both thin wires are welded by the technique of Joule heating. The other ends of wires are connected to a voltmeter. Temperature of the constructed electro-thermal circuit is controlled by flowing of the current through the circuit. The observed voltage is found to be proportional to the temperature difference between the dissimilar welding point and the chip (room temperature) which satisfies the Seebeck effect. The Seebeck coefficient is found to be about 0.2 μV/K. The temperature distribution of 5 μm Pt wire, where the constant current is flowing, is successfully measured by the fabricated very-thin Pt/W thermoelectric element.
AB - A very-thin Pt/W thermoelectric element is fabricated on a small chip. The Pt and W thin wires having the diameter of 5 μm are attached on a Cu electrode chip, and these are electrically isolated by air grove on the chip. The tips of both thin wires are welded by the technique of Joule heating. The other ends of wires are connected to a voltmeter. Temperature of the constructed electro-thermal circuit is controlled by flowing of the current through the circuit. The observed voltage is found to be proportional to the temperature difference between the dissimilar welding point and the chip (room temperature) which satisfies the Seebeck effect. The Seebeck coefficient is found to be about 0.2 μV/K. The temperature distribution of 5 μm Pt wire, where the constant current is flowing, is successfully measured by the fabricated very-thin Pt/W thermoelectric element.
UR - http://www.scopus.com/inward/record.url?scp=77953696433&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77953696433&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2010.5464556
DO - 10.1109/ESIME.2010.5464556
M3 - Conference contribution
AN - SCOPUS:77953696433
SN - 9781424470266
T3 - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
BT - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
T2 - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Y2 - 26 April 2010 through 28 April 2010
ER -