Fabrication of Einzel lens array with one-mask rie process for electron micro-optics

Eiichi Tomono, Hidetoshi Miyashita, Takahito Ono, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper reports the fabrication technique of electron micro-optics using silicon deep reactive ion etching. Stacked 120-μm-thick three silicon wafers stacked with cavities using patterned glass substrates are etched by "a direct cavity through etching technique". An array of the electron micro-optics consisted of three electrodes can be fabricated by one-mask process without alignment. The etched profiles of this cavity through etching are also investigated. This fabrication technology of electron lens is useful for making future multi-electron beam devices with electron optics.

Original languageEnglish
Title of host publicationTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages853-856
Number of pages4
DOIs
Publication statusPublished - 2009
EventTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
Duration: 2009 Jun 212009 Jun 25

Publication series

NameTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

OtherTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
CountryUnited States
CityDenver, CO
Period09/6/2109/6/25

Keywords

  • Deep reactive ion etching
  • Einzel lens
  • Electron micro-optics
  • Multi electron beam lithography

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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