Fabrication of diamond mold for imprint lithography

C. Konoma, T. Ono, H. Miyashita, Y. Kanomori, M. Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The authors propose the fabrication method for a diamond mold for imprint lithography to transfer the dot pattern onto recording media. It is expected that more high density and small dot patterns will be imprinted using the diamond mold. A diamond thin film with a thickness of about 10 μm was deposited on a Si wafer using hot-filament chemical vapor deposition (HF-CVD). The wafer with the diamond film was anodically bonded with 5 mm thick Pyrex glass via sputtered Al film as an adhesive layer. An aligned hole pattern can be successfully transferred on the diamond film by oxygen fast atom beam etching.

Original languageEnglish
Title of host publication2002 International Microprocesses and Nanotechnology Conference, MNC 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages164-165
Number of pages2
ISBN (Electronic)4891140313, 9784891140311
DOIs
Publication statusPublished - 2002 Jan 1
EventInternational Microprocesses and Nanotechnology Conference, MNC 2002 - Tokyo, Japan
Duration: 2002 Nov 62002 Nov 8

Publication series

Name2002 International Microprocesses and Nanotechnology Conference, MNC 2002

Other

OtherInternational Microprocesses and Nanotechnology Conference, MNC 2002
CountryJapan
CityTokyo
Period02/11/602/11/8

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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