Fabrication of carbon nanotube devices by electroplating with in situ observation

F. Wakaya, Y. Ogi, M. Yoshida, S. Kimura, M. Takai, Y. Akasaka, K. Gamo

Research output: Contribution to journalConference article

2 Citations (Scopus)

Abstract

Multiwall carbon nanotubes (CNTs) with Au/Ti electrodes were fabricated using electron-beam lithography, lift-off technique and successive electroplating with in situ conductance observation. Two-terminal resistance became dramatically small after the electroplating. This should be due to the small contact resistance between the CNT and the plated metal. The two-terminal resistance after the plating ranged from ≃10 kΩ to some 100 kΩ. At low temperature, low-resistance samples after the plating showed very good ohmic characteristics while high-resistance samples showed Coulomb blockade. A possibility of an in situ length dependence measurement of CNT conductance was demonstrated.

Original languageEnglish
Pages (from-to)559-563
Number of pages5
JournalMicroelectronic Engineering
Volume73-74
DOIs
Publication statusPublished - 2004 Jun
Externally publishedYes
EventMicro and Nano Engineering 2003 - Cambridge, United Kingdom
Duration: 2003 Sep 222003 Sep 25

Keywords

  • Carbon nanotube
  • Contact resistance
  • Electroplating

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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