Fabrication of capacitive micromachined ultrasonic transducer arrays using glass reflow process and anodic bonding

N. V. Toan, S. Hahng, Yunheub Song, T. Ono

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. The silicon through-wafer interconnects have been investigated by glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5×5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 μm and sensing gap of 3.2 um (distance between top and bottom electrodes) is observed at 2.83 MHz. The Q factor is approximately 1300 at vacuum chamber pressure of 0.01 Pa.

Original languageEnglish
Title of host publicationAdvanced Manufacturing, Electronics and Microsystems - TechConnect Briefs 2016
EditorsBart Romanowicz, Matthew Laudon, Fiona Case, Fiona Case, Bart Romanowicz
PublisherTechConnect
Pages91-94
Number of pages4
ISBN (Electronic)9780997511734
Publication statusPublished - 2016 Jan 1
Event10th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 19th Annual Nanotech Conference and Expo, and the 2016 National SBIR/STTR Conference - Washington, United States
Duration: 2016 May 222016 May 25

Publication series

NameAdvanced Materials - TechConnect Briefs 2016
Volume4

Other

Other10th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 19th Annual Nanotech Conference and Expo, and the 2016 National SBIR/STTR Conference
CountryUnited States
CityWashington
Period16/5/2216/5/25

Keywords

  • Anodic bonding
  • Capacitive micromachined ultrasonic transducer
  • Chemical sensing
  • Glass reflow process
  • Medical imaging
  • Non-destructive measurement

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Biotechnology
  • Surfaces, Coatings and Films
  • Fuel Technology

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