Fabrication of biocompatible lab-on-chip devices for biomedical applications by means of a 3D-printing process

S. Takenaga; B. Schneider; E. Erbay; M. Biselli; Th Schnitzler; M. J. Schöning; T. Wagner

doi:10.1002/pssa.201532053

Fabrication of biocompatible lab-on-chip devices for biomedical applications by means of a 3D-printing process

S. Takenaga, B. Schneider, E. Erbay, M. Biselli, Th Schnitzler, M. J. Schöning, T. Wagner

ENG - Electronic Engineering

Research output: Contribution to journal › Article › peer-review

38 Citations (Scopus)

Abstract

A new microfluidic assembly method for semiconductor-based biosensors using 3D-printing technologies was proposed for a rapid and cost-efficient design of new sensor systems. The microfluidic unit is designed and printed by a 3D-printer in just a few hours and assembled on a light-addressable potentiometric sensor (LAPS) chip using a photo resin. The cell growth curves obtained from culturing cells within microfluidics-based LAPS systems were compared with cell growth curves in cell culture flasks to examine biocompatibility of the 3D-printed chips. Furthermore, an optimal cell culturing within microfluidics-based LAPS chips was achieved by adjusting the fetal calf serum concentrations of the cell culture medium, an important factor for the cell proliferation.

Original language	English
Pages (from-to)	1347-1352
Number of pages	6
Journal	Physica Status Solidi (A) Applications and Materials Science
Volume	212
Issue number	6
DOIs	https://doi.org/10.1002/pssa.201532053
Publication status	Published - 2015 Jun 1

Keywords

3D printing
Chinese hamster ovary cell
fetal calf serum
lab-on-chip
light-addressable potentiometric sensor
microfluidics

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Materials Chemistry
Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films

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Fabrication of biocompatible lab-on-chip devices for biomedical applications by means of a 3D-printing process. / Takenaga, S.; Schneider, B.; Erbay, E.; Biselli, M.; Schnitzler, Th; Schöning, M. J.; Wagner, T.

In: Physica Status Solidi (A) Applications and Materials Science, Vol. 212, No. 6, 01.06.2015, p. 1347-1352.

Research output: Contribution to journal › Article › peer-review

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