Abstract
A new method named Pulsated Orifice Ejection Method (POEM) is proposed for fabrication of BGA solder balls with narrow size distribution and high sphericity. As for an orifice with a certain diameter, the diameter of solder balls is mainly affected by rod displacement and gas pressure. The size of solder ball linearly increases with the increase of both the rod displacement and the gas pressure within a certain range. The analysis of size distribution and sphericity shows that solder ball fabricated by POEM meets the requirements of BGA packaging. In addition, the solidification behavior of the droplets prepared by POEM is also discussed by theoretical calculation.
| Original language | English |
|---|---|
| Pages | 694-697 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2013 Jan 1 |
| Event | 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 - Dalian, China Duration: 2013 Aug 11 → 2013 Aug 14 |
Other
| Other | 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 |
|---|---|
| Country | China |
| City | Dalian |
| Period | 13/8/11 → 13/8/14 |
Keywords
- BGA solder ball
- High sphericity
- Narrow distribution
- Pulsated Orifice Ejection Method(POME)
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Fingerprint Dive into the research topics of 'Fabrication of BGA solder balls by pulsated orifice ejection method'. Together they form a unique fingerprint.
Cite this
Lu, D., Xu, F. M., Zhao, L., Fu, Y. F., Dong, W., Tan, Y., & Kawasaki, A. (2013). Fabrication of BGA solder balls by pulsated orifice ejection method. 694-697. Paper presented at 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China. https://doi.org/10.1109/ICEPT.2013.6756561