Fabrication of BGA solder balls by pulsated orifice ejection method

D. Lu, F. M. Xu, L. Zhao, Y. F. Fu, W. Dong, Y. Tan, Akira Kawasaki

Research output: Contribution to conferencePaper

Abstract

A new method named Pulsated Orifice Ejection Method (POEM) is proposed for fabrication of BGA solder balls with narrow size distribution and high sphericity. As for an orifice with a certain diameter, the diameter of solder balls is mainly affected by rod displacement and gas pressure. The size of solder ball linearly increases with the increase of both the rod displacement and the gas pressure within a certain range. The analysis of size distribution and sphericity shows that solder ball fabricated by POEM meets the requirements of BGA packaging. In addition, the solidification behavior of the droplets prepared by POEM is also discussed by theoretical calculation.

Original languageEnglish
Pages694-697
Number of pages4
DOIs
Publication statusPublished - 2013 Jan 1
Event2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 - Dalian, China
Duration: 2013 Aug 112013 Aug 14

Other

Other2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
CountryChina
CityDalian
Period13/8/1113/8/14

Keywords

  • BGA solder ball
  • High sphericity
  • Narrow distribution
  • Pulsated Orifice Ejection Method(POME)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Lu, D., Xu, F. M., Zhao, L., Fu, Y. F., Dong, W., Tan, Y., & Kawasaki, A. (2013). Fabrication of BGA solder balls by pulsated orifice ejection method. 694-697. Paper presented at 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China. https://doi.org/10.1109/ICEPT.2013.6756561