Fabrication of BGA solder balls by pulsated orifice ejection method

D. Lu; F. M. Xu; L. Zhao; Y. F. Fu; W. Dong; Y. Tan; Akira Kawasaki

doi:10.1109/ICEPT.2013.6756561

Fabrication of BGA solder balls by pulsated orifice ejection method

D. Lu, F. M. Xu, L. Zhao, Y. F. Fu, W. Dong, Y. Tan, Akira Kawasaki

ENG - Materials Processing

Research output: Contribution to conference › Paper › peer-review

Abstract

A new method named Pulsated Orifice Ejection Method (POEM) is proposed for fabrication of BGA solder balls with narrow size distribution and high sphericity. As for an orifice with a certain diameter, the diameter of solder balls is mainly affected by rod displacement and gas pressure. The size of solder ball linearly increases with the increase of both the rod displacement and the gas pressure within a certain range. The analysis of size distribution and sphericity shows that solder ball fabricated by POEM meets the requirements of BGA packaging. In addition, the solidification behavior of the droplets prepared by POEM is also discussed by theoretical calculation.

Original language	English
Pages	694-697
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT.2013.6756561
Publication status	Published - 2013 Jan 1
Event	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 - Dalian, China Duration: 2013 Aug 11 → 2013 Aug 14

Other

Other	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
Country	China
City	Dalian
Period	13/8/11 → 13/8/14

Keywords

BGA solder ball
High sphericity
Narrow distribution
Pulsated Orifice Ejection Method(POME)

ASJC Scopus subject areas

Electrical and Electronic Engineering

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abstract = "A new method named Pulsated Orifice Ejection Method (POEM) is proposed for fabrication of BGA solder balls with narrow size distribution and high sphericity. As for an orifice with a certain diameter, the diameter of solder balls is mainly affected by rod displacement and gas pressure. The size of solder ball linearly increases with the increase of both the rod displacement and the gas pressure within a certain range. The analysis of size distribution and sphericity shows that solder ball fabricated by POEM meets the requirements of BGA packaging. In addition, the solidification behavior of the droplets prepared by POEM is also discussed by theoretical calculation.",

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doi = "10.1109/ICEPT.2013.6756561",

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AU - Lu, D.

AU - Xu, F. M.

AU - Zhao, L.

AU - Fu, Y. F.

AU - Dong, W.

AU - Tan, Y.

AU - Kawasaki, Akira

PY - 2013/1/1

Y1 - 2013/1/1

N2 - A new method named Pulsated Orifice Ejection Method (POEM) is proposed for fabrication of BGA solder balls with narrow size distribution and high sphericity. As for an orifice with a certain diameter, the diameter of solder balls is mainly affected by rod displacement and gas pressure. The size of solder ball linearly increases with the increase of both the rod displacement and the gas pressure within a certain range. The analysis of size distribution and sphericity shows that solder ball fabricated by POEM meets the requirements of BGA packaging. In addition, the solidification behavior of the droplets prepared by POEM is also discussed by theoretical calculation.

AB - A new method named Pulsated Orifice Ejection Method (POEM) is proposed for fabrication of BGA solder balls with narrow size distribution and high sphericity. As for an orifice with a certain diameter, the diameter of solder balls is mainly affected by rod displacement and gas pressure. The size of solder ball linearly increases with the increase of both the rod displacement and the gas pressure within a certain range. The analysis of size distribution and sphericity shows that solder ball fabricated by POEM meets the requirements of BGA packaging. In addition, the solidification behavior of the droplets prepared by POEM is also discussed by theoretical calculation.

KW - BGA solder ball

KW - High sphericity

KW - Narrow distribution

KW - Pulsated Orifice Ejection Method(POME)

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T2 - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013

Y2 - 11 August 2013 through 14 August 2013

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Fabrication of BGA solder balls by pulsated orifice ejection method

Abstract

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Keywords

ASJC Scopus subject areas

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