Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies

Tim Schroeder, Joerg Froemel, Shuji Tanaka, Thomas Gessner

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

For the further miniaturization of integrated circuits, the integration of passive components on the chip is one approach. In DC-DC converter applications, the integration of the inductor with high inductivity is one problem. This paper addresses this problem by proposing a new technique for fabricating a multilayer spiral coil that is also useful as part of electromagnetic MEMS (Micro-Electro-Mechanical Systems) actuators. The multilayer coil is made by stacking separately fabricated coil layers and joining them with a selective bonding and debonding technique.

Original languageEnglish
Title of host publication2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages401-404
Number of pages4
ISBN (Electronic)9781509019472
DOIs
Publication statusPublished - 2016 Nov 28
Event11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 - Sendai, Japan
Duration: 2016 Apr 172016 Apr 20

Publication series

Name2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016

Other

Other11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
CountryJapan
CitySendai
Period16/4/1716/4/20

Keywords

  • VLSI
  • die-to-wafer bonding
  • monolithic DC-DC converter
  • multilayer inductor
  • selective debonding

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Schroeder, T., Froemel, J., Tanaka, S., & Gessner, T. (2016). Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies. In 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 (pp. 401-404). [7758277] (2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2016.7758277