Fabrication and packaging process of silicon resonators capable of the integration of LSI for application of timing device

Nguyen Van Toan, Hidetoshi Miyashita, Masaya Toda, Yusuke Kawai, Takahito Ono

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this paper, silicon resonators were hermetically packaged on basis of anodic bonding of Si and LTCC (Low Temperature Co-fired ceramic) substrates. This research aims at developing the integration technology of the resonator on LSI (Large Scale Integration) for application of a timing device. The structures of the resonators were transferred onto the LTCC substrate using the anodic bonding of silicon and LTCC for electrical interconnections. Then the resonator structures were packaged hermetically by the second anodic bonding of silicon and Tempax glass for encapsulation. The device can be directly bonded to LSI.

Original languageEnglish
Title of host publicationIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Pages377-380
Number of pages4
DOIs
Publication statusPublished - 2013 Apr 2
EventIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan, Province of China
Duration: 2013 Jan 202013 Jan 24

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

OtherIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
CountryTaiwan, Province of China
CityTaipei
Period13/1/2013/1/24

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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