Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration

Murugesan Mariappan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Jichoru Be, Takafumi Fukushima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An advanced Directed-Self-Assembly (DSA) assisted vertical nano-scale interconnection formation has been attempted inside deep Si trench structures for ultra-high-density 3D storage memory application. Based on Flory-Huggins theory, nano-cylindrical structures with and without metal nano-particles were obtained for a nano-composite containing di-block co-polymer system and novel metal nanoparticles. The low-Temperature transmission electron micros-copy was primarily used to analyze the DSA-formed vertical nano-structures inside Si deep trenches.

Original languageEnglish
Title of host publicationIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728148700
DOIs
Publication statusPublished - 2019 Oct
Event2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 - Sendai, Japan
Duration: 2019 Oct 82019 Oct 10

Publication series

NameIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019

Conference

Conference2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
CountryJapan
CitySendai
Period19/10/819/10/10

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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