Extremely flexible (1mm Bending Radius) biocompatible heterogeneous fan-out wafer-level platform with the lowest reported die-shift (<6 μm) and reliable flexible cu-based interconnects

Amir Hanna, Arsalan Alam, Takafumi Fukushima, Steven Moran, William Whitehead, Siva Chandra Jangam, Saptadeep Pal, Goutham Ezhilarasu, Randall Irwin, Adeel Bajwa, Subramanian Iyer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

A flexible fan-out wafer-level packaging (FOWLP) process for heterogeneous integration of high performance dies in a flexible and biocompatible elastomeric package (FlexTrateTM) was used to assemble >600 dies with co-planarity and tilt <1μm, average die-shift of 3.28 μm with ? < 2.23 μm. We have also engineered a novel corrugated topography of a stress buffer layer for metal interconnects on FlexTrateTM to mitigate the buckling phenomenon of metal films deposited on elastomeric substrates. Corrugated interconnects were then tested for their mechanical bending reliability and have shown less than 0.4% change in resistance after bending at 1 mm radius for 1,000 cycles. Finally, we demonstrate integration of an array of 25 dielets interconnected in a daisy chain configuration at 40 μm interconnect pitch.

Original languageEnglish
Title of host publicationProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1505-1511
Number of pages7
ISBN (Print)9781538649985
DOIs
Publication statusPublished - 2018 Aug 7
Event68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
Duration: 2018 May 292018 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2018-May
ISSN (Print)0569-5503

Other

Other68th IEEE Electronic Components and Technology Conference, ECTC 2018
CountryUnited States
CitySan Diego
Period18/5/2918/6/1

Keywords

  • Bendable interconnect
  • Biocompatible
  • FOWLP
  • Flexible device integration
  • Metallization of PDMS

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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