Expression of a governing parameter for electromigration damage on metal line ends

Masataka Hasegawa, Kazuhiko Sasagawa, Masumi Saka, Hiroyuki Abé

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Recently, a governing parameter for electromigration damage, AFD*gen, was identified and, utilizing the parameter, a prediction method of electromigration failure was developed for the passivated polycrystalline line. The parameter AFD*gen was formulated considering the divergence of atomic flux due to electromigration in grain boundary network, and the boundary condition of metal line ends was not taken into account. So far, therefore, failure prediction was exclusively done for the metal line connected by electric-current input/output pads at both ends, not for the line connected by vias at both ends. It is known that there is threshold current density, jth, below which no electromigration damage appears, in the line connected by vias. In this study, first, a governing parameter for electromigration damage on the ends of passivated polycrystalline line is expressed considering the boundary condition of line ends concerning the atomic diffusion. Next, the way to estimate the threshold current density of the metal line with vias is shown based on the numerical simulation using the governing parameter.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging 2003
Subtitle of host publicationVolume 1
PublisherAmerican Society of Mechanical Engineers
Pages717-722
Number of pages6
ISBN (Print)0791836908, 9780791836903
DOIs
Publication statusPublished - 2003
Event2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, United States
Duration: 2003 Jul 62003 Jul 11

Publication series

NameAdvances in Electronic Packaging
Volume1

Other

Other2003 International Electronic Packaging Technical Conference and Exhibition
Country/TerritoryUnited States
CityHaui, HI
Period03/7/603/7/11

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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