Experimental Methods for Reliability Evaluation of Electronic Packages and Modules

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)152-156
Number of pages5
JournalJournal of Japan Institute of Electronics Packaging
Volume9
Issue number3
DOIs
Publication statusPublished - 2006

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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