Experimental Methods for Inspection and Reliability Evaluation of Electronic Packages and Modules

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)585-590
Number of pages6
JournalJournal of Japan Institute of Electronics Packaging
Volume8
Issue number7
DOIs
Publication statusPublished - 2005 Jan 1

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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