Experimental Methods for Inspection and Reliability Evaluation of Electronic Packages and Modules

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	585-590
Number of pages	6
Journal	Journal of Japan Institute of Electronics Packaging
Volume	8
Issue number	7
DOIs	https://doi.org/10.5104/jiep.8.585
Publication status	Published - 2005

ASJC Scopus subject areas

@article{64bdc96d727246abab13dd6722cf70b8,

title = "Experimental Methods for Inspection and Reliability Evaluation of Electronic Packages and Modules",

author = "Hideo Miura",

year = "2005",

doi = "10.5104/jiep.8.585",

language = "English",

volume = "8",

pages = "585--590",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "7",

}

TY - JOUR

T1 - Experimental Methods for Inspection and Reliability Evaluation of Electronic Packages and Modules

AU - Miura, Hideo

PY - 2005

Y1 - 2005

UR - http://www.scopus.com/inward/record.url?scp=85024461286&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85024461286&partnerID=8YFLogxK

U2 - 10.5104/jiep.8.585

DO - 10.5104/jiep.8.585

M3 - Article

AN - SCOPUS:85024461286

SN - 1343-9677

VL - 8

SP - 585

EP - 590

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

IS - 7

ER -