Expansion of the Beamforming Coverage Area in an Elevation Plane for 60-GHz-Band 3D Beamforming

Satoshi Yoshida, Mizuki Motoyoshi, Suguru Kameda, Noriharu Suematsu, Kenjiro Nishikawa

Research output: Contribution to journalArticlepeer-review


This paper proposes a novel antenna structure for 60-GHz-band three-dimensional coverage beamforming. By using the proposed antenna structure, the coverage area can be expanded in an elevation plane. Dipole and patch sub-array antennas were packaged into one structure by using the copper balls interconnection technique. A simple idea to utilize dipole and patch elements enables end-fire and broadside radiations resulting in the coverage area expansion in the elevation plane. Two 2x4 array antennas were made up of eight multilayered substrate. Six metal layers were used for each multilayered substrate.

Original languageEnglish
JournalIEEE Antennas and Wireless Propagation Letters
Publication statusAccepted/In press - 2021


  • 60 GHz
  • Antenna arrays
  • Array signal processing
  • beamforming
  • Copper
  • Dipole antennas
  • millimeter-wave
  • Mixers
  • packaging and interconnects
  • phased array antenna
  • Phased arrays
  • planar antenna
  • Substrates

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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