Expansion of the Beamforming Coverage Area in an Elevation Plane for 60 GHz Band 3-D Beamforming

Satoshi Yoshida, Mizuki Motoyoshi, Suguru Kameda, Noriharu Suematsu, Kenjiro Nishikawa

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

This letter proposes a novel antenna structure for 60 GHz band 3-D coverage beamforming. By using the proposed antenna structure, the coverage area can be expanded in an elevation plane. Dipole and patch subarray antennas were packaged into one structure by using the copper balls interconnection technique. A simple idea to utilize dipole and patch elements enables endfire and broadside radiations resulting in the coverage area expansion in the elevation plane. Two 2 × 4 array antennas were made up of eight multilayered substrate. Six metal layers were used for each multilayered substrate.

Original languageEnglish
Article number9369036
Pages (from-to)773-777
Number of pages5
JournalIEEE Antennas and Wireless Propagation Letters
Volume20
Issue number5
DOIs
Publication statusPublished - 2021 May
Externally publishedYes

Keywords

  • 60 GHz
  • Beamforming
  • millimeter-wave
  • packaging and interconnects
  • phased-Array antenna
  • planar antenna

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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