Abstract
The behavior of excess currents induced by Fowler-Nordheim electron injection stress (FN electron injection) has been investigated for 6.0-nm oxides. Excess currents are induced by FN electron injection in 6.0-nm oxides together with positive charges being induced in it. To clarify the role of hole injection in FN electron injection, the behavior of excess currents induced by substrate hot hole injection has also been investigated in 6.0-nm oxides. The leakage behavior after hot hole injection is the same as FN electron injection. The excess currents induced both by the FN electron injection and by the substrate hot hole injection are due to trap-assisted tunneling and field enhancement at the cathode due to the positive trapped charge. The charge centroid of the positive charges induced by both stresses are located 3.0 nm from the Si/SiO2 interface which is at the center of 6.0-nm oxide. The excess currents induced by hot hole injection and FN electron injection are caused by traps in SiO2 films produced by injected holes from the anode.
Original language | English |
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Pages (from-to) | 868-873 |
Number of pages | 6 |
Journal | IEEE Transactions on Electron Devices |
Volume | 48 |
Issue number | 5 |
DOIs | |
Publication status | Published - 2001 May 1 |
Externally published | Yes |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Physics and Astronomy (miscellaneous)