Evolution of microstructures and texture in the surface layer of copper during burnishing process

X. Zhang, H. Luo, Z. Han, J. Lv

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The evolution of microstructures and texture subjected to a burnishing process in pure copper was investigated by transmission electron microscopy and electron backscattered diffraction. The grains of the top surface underwent significant refinement with a minimum grain size of ~100 nm. The grain refinement was dominated by dislocation activities, including formation of dislocation cells, transformation of cell walls into sub-grain boundaries, development of highly disoriented sub-boundaries and generation of equiaxed grains. Shear strain induced by friction affected the strain state at the first pass of burnishing, resulting in a {001}, <110> shear texture. Brass orientation developed well at the early stage of burnishing. Then, with a further increase in plastic strain, Brass orientation decreased, while the Goss orientation was observed, which mainly owing to the transformation from Brass to Goss orientation by rotation along the α-fibre. Moreover, dynamic recrystallisation occurred as the strain increased.

Original languageEnglish
Pages (from-to)1742-1750
Number of pages9
JournalMaterials Science and Technology (United Kingdom)
Volume30
Issue number14
DOIs
Publication statusPublished - 2014 Nov 1

Keywords

  • Burnishing
  • Grain refinement
  • Microstructures
  • Surface layer
  • Texture

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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