Evaluation of thermal conductive resistance at organic-inorganic interface and development of thermal conductive insulation materials for electric devices

Keiji Fukushima, Yoshitaka Takezawa, Tadafumi Adschiri

Research output: Contribution to journalConference articlepeer-review

Abstract

The effect of organic-inorganic interfaces on thermal conductivity of composite materials has been studied by evaluating thermal conductive resistance at the organic-inorganic interfaces experimentally. Polymer layer was sandwiched with thin ceramic plates to make multi-layer stacked samples. Through the comparison of the thermal conductivity of the multi-layer-stacked materials, and those of the single component materials for both polymer and ceramics, the thermal resistance at the interface between polymer and ceramic plate was evaluated. This suggests that the contribution of thermal-resistance become significant for composite materials because of the increase of interface. The results also demonstrate that the organic modifications of inorganic surface could effectively reduce the interfacial thermal resistance. Control of the interfaces seems to be effective to improve thermal conducting property of materials. On the other hand, control of inner structures in the materials is also important. We also investigated effects of inner structures on both thermal conducting and electrical insulating properties of the materials. Based on the results, high thermal conductive insulating materials were newly designed.

Original languageEnglish
Article number6232663
Pages (from-to)330-333
Number of pages4
JournalAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
DOIs
Publication statusPublished - 2011
Event2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011 - Cancun, Mexico
Duration: 2011 Oct 162011 Oct 19

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Evaluation of thermal conductive resistance at organic-inorganic interface and development of thermal conductive insulation materials for electric devices'. Together they form a unique fingerprint.

Cite this