Evaluation of the relationship between the tensile strength of a grain boundary in electroplated copper thin films and the crystallinity of the grain boundary using micro tensile test

Guoxiong Zheng, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In the semiconductor device field, the element materials constituting the interior of the semiconductor devices are rapidly miniaturized due to continuous improvement of high performance and power saving. However, it's getting harder to guarantee the long-term reliability of products because of the various degradation phenomena such as very high local Joule heating and electromigration (EM). Recently, it is reported that EM tends to occur along the grain boundaries in the interconnection material, and thus, it is necessary to quantitatively evaluate the grain boundary strength for estimating the lifetime of the interconnection and clarification of the dominant factors in order to assure the product reliability. In this study, grain boundary quality in terms of order of atomic arrangement was evaluated by using the analysis parameter IQ (Image Quality) value obtained from electron back-scatter diffraction (EBSD) method, and grain boundary strength was evaluated quantitatively by applying micro tensile test method to electroplated copper thin films used as an interconnection material. As a result, it was found that the strength of both a grain and a grain boundary changed as a function of the order of the atomic arrangement. In the low IQ value range, brittle fracture occurred at a grain boundary, and the strength of a grain boundary monotonically decreased as the IQ value decreased. On the other hand, in the high IQ value range, transgranular ductile fracture appeared and the yield stress of a grain monotonically decreased as the IQ value increased. Therefore, the IQ values was found to be the dominant factor of the strength of a grain and a grain boundary.

Original languageEnglish
Title of host publicationIMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
PublisherIEEE Computer Society
Pages179-182
Number of pages4
ISBN (Electronic)9781538647196
DOIs
Publication statusPublished - 2017 Jul 1
Event12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan, Province of China
Duration: 2017 Oct 252017 Oct 27

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2017-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Other

Other12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
CountryTaiwan, Province of China
CityTaipei
Period17/10/2517/10/27

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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