TY - GEN
T1 - Evaluation of the crystallographic quality of electroplated copper thin-film interconnections embedded in TSV structures
AU - Furuya, Ryosuke
AU - Suzuki, Ken
AU - Miura, Hideo
PY - 2012/12/1
Y1 - 2012/12/1
N2 - Electroplated copper thin films have started to be applied to the Through Silicon Via (TSV) interconnections. Unfortunately, however, the electrical resistivity of the electroplated copper thin films was found to vary drastically comparing with those of the conventional bulk copper. This was because that the films consisted of grains with low crystallographic quality and a lot of porous grain boundaries. In this study, the electroplated copper thin film interconnections were embedded in a silicon substrate to model the TSV structure. It was observed that many voids and hillocks appeared on the surface of the films after annealed at 400°C. In addition, it was also found that the electrical resistivity of the films without annealing was much higher than that of bulk copper. As a result, it is very important to evaluate the crystallographic quality of the electroplated copper thin films after electroplated to assure the long-term reliability.
AB - Electroplated copper thin films have started to be applied to the Through Silicon Via (TSV) interconnections. Unfortunately, however, the electrical resistivity of the electroplated copper thin films was found to vary drastically comparing with those of the conventional bulk copper. This was because that the films consisted of grains with low crystallographic quality and a lot of porous grain boundaries. In this study, the electroplated copper thin film interconnections were embedded in a silicon substrate to model the TSV structure. It was observed that many voids and hillocks appeared on the surface of the films after annealed at 400°C. In addition, it was also found that the electrical resistivity of the films without annealing was much higher than that of bulk copper. As a result, it is very important to evaluate the crystallographic quality of the electroplated copper thin films after electroplated to assure the long-term reliability.
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U2 - 10.1109/EMAP.2012.6507852
DO - 10.1109/EMAP.2012.6507852
M3 - Conference contribution
AN - SCOPUS:84880275575
SN - 9781467349444
T3 - 14th International Conference on Electronic Materials and Packaging, EMAP 2012
BT - 14th International Conference on Electronic Materials and Packaging, EMAP 2012
T2 - 14th International Conference on Electronic Materials and Packaging, EMAP 2012
Y2 - 13 December 2012 through 16 December 2012
ER -