Evaluation of the crystallographic quality of electroplated copper thin-film interconnection embedded in a SI substrate

Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Electroplated copper thin films have started to be applied to the interconnection material in TSV structuresbecause of its low electric resistivity and high thermal conductivity. However, the electrical resistivity of the electroplatedcopper thin films surrounded by SiO2was found to vary drastically comparing with those of the conventional bulk material. This was because that the electroplated copper thin films consisted of grains with low crystallinity and grain boundaries with high defect density. Thus,in this study,both the crystallinity and electrical properties of the electroplated copper thin films embedded in the TSV structure was evaluated quantitatively by changing the electroplatingconditions and thermal history after the electroplating. It was observed that many voids and hillocks appeared in the TSV structures after the high temperature annealing which was introduced for improving the crystallinity of the electroplated films. Therefore, it is very important to evaluate the crystallographic quality of the electroplated copper thin films after electroplating to assure both the mechanical and electrical properties of the films.

Original languageEnglish
Title of host publicationASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOIs
Publication statusPublished - 2013 Dec 1
EventASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
Duration: 2013 Jul 162013 Jul 18

Publication series

NameASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume1

Other

OtherASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Country/TerritoryUnited States
CityBurlingame, CA
Period13/7/1613/7/18

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Information Systems
  • Electronic, Optical and Magnetic Materials

Fingerprint

Dive into the research topics of 'Evaluation of the crystallographic quality of electroplated copper thin-film interconnection embedded in a SI substrate'. Together they form a unique fingerprint.

Cite this