Abstract
The change of the crystallinity of grain boundaries of the electroplated copper thin films used for the various interconnections in electronic products was evaluated quantitatively by applying an electron back-scattering diffraction analysis. It was found that the crystallinity of the electroplated films varied drastically depending on the electroplating conditions such as the composition of solute, temperature of the plating, the current density during electroplating, the surface material on the substrate, and so on. It also changed after the annealing at temperatures higher than 200°C. The change of the crystallinity of the films caused the drastic variation of both the electrical and mechanical reliability of the films.
Original language | English |
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Title of host publication | 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 |
Pages | 1153-1158 |
Number of pages | 6 |
DOIs | |
Publication status | Published - 2012 Oct 4 |
Event | 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States Duration: 2012 May 29 → 2012 Jun 1 |
Other
Other | 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 |
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Country | United States |
City | San Diego, CA |
Period | 12/5/29 → 12/6/1 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering