Evaluation of the crystallinity of grain boundaries of electronic copper thin films for highly reliable interconnections

Naoki Saito, Naoakzu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

The change of the crystallinity of grain boundaries of the electroplated copper thin films used for the various interconnections in electronic products was evaluated quantitatively by applying an electron back-scattering diffraction analysis. It was found that the crystallinity of the electroplated films varied drastically depending on the electroplating conditions such as the composition of solute, temperature of the plating, the current density during electroplating, the surface material on the substrate, and so on. It also changed after the annealing at temperatures higher than 200°C. The change of the crystallinity of the films caused the drastic variation of both the electrical and mechanical reliability of the films.

Original languageEnglish
Title of host publication2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Pages1153-1158
Number of pages6
DOIs
Publication statusPublished - 2012 Oct 4
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States
Duration: 2012 May 292012 Jun 1

Other

Other2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
CountryUnited States
CitySan Diego, CA
Period12/5/2912/6/1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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