Evaluation of the crystallinity of grain boundaries of electronic copper thin films for highly reliable interconnections

Naoki Saito; Naoakzu Murata; Kinji Tamakawa; Ken Suzuki; Hideo Miura

doi:10.1109/ECTC.2012.6248981

Evaluation of the crystallinity of grain boundaries of electronic copper thin films for highly reliable interconnections

Naoki Saito, Naoakzu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

ENG - Fracture and Reliability Research Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

16 Citations (Scopus)

Abstract

The change of the crystallinity of grain boundaries of the electroplated copper thin films used for the various interconnections in electronic products was evaluated quantitatively by applying an electron back-scattering diffraction analysis. It was found that the crystallinity of the electroplated films varied drastically depending on the electroplating conditions such as the composition of solute, temperature of the plating, the current density during electroplating, the surface material on the substrate, and so on. It also changed after the annealing at temperatures higher than 200°C. The change of the crystallinity of the films caused the drastic variation of both the electrical and mechanical reliability of the films.

Original language	English
Title of host publication	2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Pages	1153-1158
Number of pages	6
DOIs	https://doi.org/10.1109/ECTC.2012.6248981
Publication status	Published - 2012
Event	2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States Duration: 2012 May 29 → 2012 Jun 1

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Other

Other	2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Country/Territory	United States
City	San Diego, CA
Period	12/5/29 → 12/6/1

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/ECTC.2012.6248981

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Saito, N., Murata, N., Tamakawa, K., Suzuki, K., & Miura, H. (2012). Evaluation of the crystallinity of grain boundaries of electronic copper thin films for highly reliable interconnections. In 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 (pp. 1153-1158). [6248981] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2012.6248981

Evaluation of the crystallinity of grain boundaries of electronic copper thin films for highly reliable interconnections. / Saito, Naoki; Murata, Naoakzu; Tamakawa, Kinji; Suzuki, Ken ; Miura, Hideo.

2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012. 2012. p. 1153-1158 6248981 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Saito, N, Murata, N, Tamakawa, K, Suzuki, K & Miura, H 2012, Evaluation of the crystallinity of grain boundaries of electronic copper thin films for highly reliable interconnections. in 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012., 6248981, Proceedings - Electronic Components and Technology Conference, pp. 1153-1158, 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012, San Diego, CA, United States, 12/5/29. https://doi.org/10.1109/ECTC.2012.6248981

Saito N, Murata N, Tamakawa K, Suzuki K , Miura H. Evaluation of the crystallinity of grain boundaries of electronic copper thin films for highly reliable interconnections. In 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012. 2012. p. 1153-1158. 6248981. (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2012.6248981

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Evaluation of the crystallinity of grain boundaries of electronic copper thin films for highly reliable interconnections

Abstract

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