Evaluation of substrate noise coupling in RFICs (invited)

Makoto Nagata, Xihua Lin, Naoya Azuma, Masahiro Yamaguchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Substrate noise coupling and impacts on RF integrated circuits (RFICs) have been intensively studied for intending a single chip solution of wireless communication systems. On-chip measurements characterize noises from digital parts of mixed-signal ICs in terms of noise generation as well as noise propagation through a silicon substrate, demonstrated by silicon results with sub-100 nm CMOS test vehicles. Simulation and emulation help further understanding of the interference of such noises with RFIC operation as well as their impacts on RF communication.

Original languageEnglish
Title of host publication2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011
Pages141-144
Number of pages4
DOIs
Publication statusPublished - 2011 Dec 1
Event4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011 - Beijing, China
Duration: 2011 Nov 302011 Dec 2

Publication series

Name2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011

Other

Other4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011
Country/TerritoryChina
CityBeijing
Period11/11/3011/12/2

Keywords

  • CMOS RF Circuits
  • Signal Integrity
  • Substrate Noise

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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