Evaluation of Strength and Reliability of Electronic Packages and Modules Based on Structural Analysis

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)
Original languageEnglish
Pages (from-to)427-432
Number of pages6
JournalJournal of Japan Institute of Electronics Packaging
Volume10
Issue number5
DOIs
Publication statusPublished - 2007 Jan 1

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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