Evaluation of high frequency characteristics of ALIVH substrate for 60 GHz RF modules

Hiroyuki Nakase, Takashi Fujii, Shoichi Oshima, Hiroshi Oguma, Suguru Kameda, Yoji Isota, Kazuo Tsubouchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

High frequency characteristics of any layer interstitial via hole (ALIVH) substrate have been evaluated for an application to the RF modules on 60GHz. A dielectric constant and loss tangent up to 60GHz was measured using strip line resonator designed on the ALIVH substrate. Measured dielectric constant 3.85-3.47 and loss tangent of 0.032-0.043 were almost constant from 2.5GHz to 60GHz. Equivalent lumped component circuit of via hole was modeled from measurement of frequency of strip line resonator with via hole. T-type LC circuit was employed for the circuit The evaluated inductance was 0.090-0.128 nH and capacitance was 0.129-0.195 pF. It was confirmed that the high frequency characteristics of ALIVH were sufficient for the application to RF module and 3-D SiP with no critical degradation.

Original languageEnglish
Title of host publication2006 8th Electronics Packaging Technology Conference, EPTC
Pages639-642
Number of pages4
DOIs
Publication statusPublished - 2006 Dec 1
Event2006 8th Electronics Packaging Technology Conference, EPTC - , Singapore
Duration: 2006 Dec 62006 Dec 8

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2006 8th Electronics Packaging Technology Conference, EPTC
CountrySingapore
Period06/12/606/12/8

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Evaluation of high frequency characteristics of ALIVH substrate for 60 GHz RF modules'. Together they form a unique fingerprint.

  • Cite this

    Nakase, H., Fujii, T., Oshima, S., Oguma, H., Kameda, S., Isota, Y., & Tsubouchi, K. (2006). Evaluation of high frequency characteristics of ALIVH substrate for 60 GHz RF modules. In 2006 8th Electronics Packaging Technology Conference, EPTC (pp. 639-642). [4147317] (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/EPTC.2006.342788