Evaluation of glass materials by using the line-focus-beam ultrasonic-material-characterization system

Jun Ichi Kushibiki, Mototaka Arakawa, Yuji Ohashi, Ryoichi Okabe

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Abstract

We developed experimental procedures to evaluate glass materials using the line-focus-beam ultrasonic-material-characterization (LFB-UMC) system. We prepared 28 specimens of a commercial borosilicate glass from random lots, and measured the velocities of leaky-surface acoustic waves (LSAWs) and leaky-surface-skimming compressional waves (LSSCWs), VLSAW and V LSSCW, using V(z) curve measurements at 225 MHz and 23°C. The velocities for VLSAW ranged from 3121.83 m/s to 3149.77 m/s, with a maximum deviation of 27.94 m/s. The velocities for VLSSCW ranged from 5547.7 m/s to 5585.0 m/s, with a maximum deviation of 37.3 m/s. To investigate these observed variations in VLSAW and VLSSCW, we measured the bulk acoustic wave (BAW) properties, viz., longitudinal and shear velocities, then the densities and the chemical compositions of 8 of the 28 specimens. The LFBUMC measurements confirmed that decreases in VLSAW and VLSSCW occur mainly with the B2O3 dopant concentrations, corresponding to the decrease of shear-wave and longitudinal-wave velocities that are caused by the decrease of the stiffness constants c44 and c11, respectively, rather than with decreased densities. The sensitivities are -6.36 × 10-2 wt%/(m/s) for VLSAW and -4.87 × 10-2 wt%/(m/s) for VLSSCW. This demonstrates that the LFB-UMC system is effective for evaluating glass materials and controlling production processes, by analyzing variations in chemical composition through the super-accurate velocity measurements of LSAWs and LSSCWs.

Original languageEnglish
Pages (from-to)1152-1159
Number of pages8
JournalIEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
Volume52
Issue number7
DOIs
Publication statusPublished - 2005 Jul

ASJC Scopus subject areas

  • Instrumentation
  • Acoustics and Ultrasonics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Evaluation of glass materials by using the line-focus-beam ultrasonic-material-characterization system'. Together they form a unique fingerprint.

Cite this