Evaluation of Fracture Strength of Thin Films by Indentation with a Small Spherical Indenter

Hiroyuki Kagawa, Masahiro Ichikawa, Tohru Takamatsu, Hiroki Kuwano

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


In electronic devices and magnetic disks, thin films are used in the form of films coated on substrates. In order to improve their mechanical reliability, it is necessary to evaluate the fracture strength of a thin film which is coated on a substrate. However, methods for evaluating it have not yet been established. In this paper, a method is proposed for evaluating fracture strength of thin films by means of indentation with a small spherical indenter, and usefulness of the method was investigated. A Si02 film coated on a stainless steel SUS440C plate by ion beam sputtering was indented with a SiC spherical indenter. The fracture strength of the film was evaluated by combining the ring crack initiation load obtained experimentally and the result of finite-element method (FEM) analysis.

Original languageEnglish
Pages (from-to)396-401
Number of pages6
JournalTransactions of the Japan Society of Mechanical Engineers Series A
Issue number570
Publication statusPublished - 1994
Externally publishedYes


  • Acoustic Emission
  • Brittle Fracture
  • Fracture Strength
  • Indentation
  • Material Testing
  • Probabilistic Method
  • Ring Crack
  • Spherical Indenter
  • Thin Film

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering


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