Evaluation of Cu diffusion from Cu through-silicon via (TSV) in three-dimensional LSI by transient capacitance measurement

Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journalArticlepeer-review

38 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Evaluation of Cu diffusion from Cu through-silicon via (TSV) in three-dimensional LSI by transient capacitance measurement'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds