Evaluation and improvement of the adhesive fracture toughness of CVD diamond on silicon substrate

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé

Research output: Contribution to conferencePaperpeer-review

Abstract

CVD diamond particles were produced on silicon substrates under various conditions such as different methane concentration in the source gas mixture and the substrate temperature, and their adhesive fracture toughness was evaluated. We confirmed that the adequate control of methane concentration could improve the toughness almost five times as large. The discussion is focused on the composition of different phases of carbon in the particles. The graphite content in the diamond particle seems to closely relate to the enhancement of adhesive fracture toughness. Detailed microscopic observations are also carried out about the fracture morphology along the interface and about the cross-sections of the diamond particles. The nanoscale crystal structure of diamond particles is also found to play an important role on the adhesive fracture toughness.

Original languageEnglish
Publication statusPublished - 1999 Dec 1
EventInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA
Duration: 1999 Jun 131999 Jun 19

Other

OtherInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'
CityMaui, HI, USA
Period99/6/1399/6/19

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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