TY - CHAP
T1 - Eutectic Au-In Bonding
AU - Koyanagi, Mitsumasa
AU - Motoyoshi, Makoto
PY - 2012/2/8
Y1 - 2012/2/8
KW - Epoxy adhesive injection
KW - Eutectic Au-In bonding
KW - High-density Au-In microbumps
KW - Large-scale integration
KW - Three-dimensional integration
UR - http://www.scopus.com/inward/record.url?scp=84885744139&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84885744139&partnerID=8YFLogxK
U2 - 10.1002/9783527644223.ch8
DO - 10.1002/9783527644223.ch8
M3 - Chapter
AN - SCOPUS:84885744139
SN - 9783527326464
SP - 139
EP - 159
BT - Handbook of Wafer Bonding
PB - Wiley-VCH
ER -