Eutectic Au-In Bonding

Mitsumasa Koyanagi, Makoto Motoyoshi

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Citation (Scopus)
Original languageEnglish
Title of host publicationHandbook of Wafer Bonding
PublisherWiley-VCH
Pages139-159
Number of pages21
ISBN (Print)9783527326464
DOIs
Publication statusPublished - 2012 Feb 8

Keywords

  • Epoxy adhesive injection
  • Eutectic Au-In bonding
  • High-density Au-In microbumps
  • Large-scale integration
  • Three-dimensional integration

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Koyanagi, M., & Motoyoshi, M. (2012). Eutectic Au-In Bonding. In Handbook of Wafer Bonding (pp. 139-159). Wiley-VCH. https://doi.org/10.1002/9783527644223.ch8