Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures

Chienliu Chang, Yeong Feng Wang, Yoshiaki Kanamori, Ji Jheng Shih, Yusuke Kawai, Chih Kung Lee, Kuang Chong Wu, Masayoshi Esashi

Research output: Contribution to journalArticle

114 Citations (Scopus)

Abstract

This paper reports solutions to the issues of profile control, microloading effect and suppression of the sidewall roughness of submicrometer trenches by modifying the regular conditions of the Bosch process that is often employed in the inductively coupled plasma (ICP) deep reactive ion etching (DRIE) system. Additionally, under the modified processing conditions, a high efficient antireflection structure can be fabricated.

Original languageEnglish
Pages (from-to)580-585
Number of pages6
JournalJournal of Micromechanics and Microengineering
Volume15
Issue number3
DOIs
Publication statusPublished - 2005 Mar 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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