Abstract
Amorphous Si3N4-C[Am.CVD-(Si3N4] composites (C: 0.6 to 6 wt%) were prepared by chemical vapour deposition (CVD) using SiCl4, H2, NH3and C3H8 gases, and their etching characteristics in 47% hydrofluoric acid (HF) solution were investigated in the temperature range of 25 to 50° C. It was found that the etching rate decreases with increasing carbon content. The etching rate of the Am.CVD-(Si3N4-C) composite containing 6 wt% carbon was about 1/40 of the rate for carbon free Am.CVD-Si3N4. The activation energies obtained from the temperature dependence of the etching rates were 11 to 17 kcal mol-1, which increased with increasing carbon content. This paper also presents the study on the characteristics of the etched surfaces as well as the carbon state in the Am.CVD-(Si3N4-C) composites, and finally the possible etching mechanism is discussed.
Original language | English |
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Pages (from-to) | 3387-3392 |
Number of pages | 6 |
Journal | Journal of Materials Science |
Volume | 18 |
Issue number | 11 |
DOIs | |
Publication status | Published - 1983 Nov 1 |
ASJC Scopus subject areas
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering