Abstract
In this paper, we present a novel process for the fabrication of thin diaphragms in lithium niobate (LiNbO3) wafers for various sensor applications. The process uses a thermal inversion layer as an etch stop. Thermal inversion is a process which forms a layer with a poling direction opposite to that of the bulk crystal. The thermal inversion layer can be used as an etch stop because the etch rate on the +Z face in hydrofluoric acid is much slower than that on the -Z face. The thickness of the thermal inversion layer determines the thickness of the final diaphragm; diaphragms with thicknesses of 6 and 30 μm have been fabricated in Z-cut and 128°-Y-cut wafers, respectively.
Original language | English |
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Pages (from-to) | L1099-L1101 |
Journal | Japanese Journal of Applied Physics, Part 2: Letters |
Volume | 46 |
Issue number | 45-49 |
DOIs | |
Publication status | Published - 2007 Dec 14 |
Keywords
- Bulk micromachining
- Diaphragm
- LiNbO
- Lithium niobate
- Thermal inversion
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)