Etch stop process for fabrication of thin diaphragms in lithium niobate

Andrew B. Randles, Masayoshi Esashi, Shuji Tanaka

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


In this paper, we present a novel process for the fabrication of thin diaphragms in lithium niobate (LiNbO3) wafers for various sensor applications. The process uses a thermal inversion layer as an etch stop. Thermal inversion is a process which forms a layer with a poling direction opposite to that of the bulk crystal. The thermal inversion layer can be used as an etch stop because the etch rate on the +Z face in hydrofluoric acid is much slower than that on the -Z face. The thickness of the thermal inversion layer determines the thickness of the final diaphragm; diaphragms with thicknesses of 6 and 30 μm have been fabricated in Z-cut and 128°-Y-cut wafers, respectively.

Original languageEnglish
JournalJapanese Journal of Applied Physics, Part 2: Letters
Issue number45-49
Publication statusPublished - 2007 Dec 14


  • Bulk micromachining
  • Diaphragm
  • LiNbO
  • Lithium niobate
  • Thermal inversion

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy (miscellaneous)
  • Physics and Astronomy(all)


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