Erratum: Self-Assembled nano-Stuffing structure in CVD and ALD Co(W) films as a single-layered barrier/liner for future cu-interconnects (ECS Journal of Solid State Science and Technology (2013) 2 (P471))

Hideharu Shimizu, Akihito Kumamoto, Kohei Shima, Yoshihiko Kobayashi, Takeshi Momose, Takeshi Nogami, Yukihiro Shimogaki

Research output: Contribution to journalComment/debatepeer-review

Original languageEnglish
Pages (from-to)X1-X2
JournalECS Journal of Solid State Science and Technology
Volume3
Issue number7
DOIs
Publication statusPublished - 2014 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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