Enhancing Transport Performance in 7-filamentary Ba0.6K0.4Fe2As2 Wires and Tapes via Hot Isostatic Pressing

Shifa Liu, Chao Yao, He Huang, Chiheng Dong, Wenwen Guo, Zhe Cheng, Yanchang Zhu, Satoshi Awaji, Yanwei Ma

Research output: Contribution to journalArticlepeer-review

Abstract

Iron-based superconductors (IBS) are considered as potential materials for manufacturing high-field magnets, for which developing multi-filamentary conductors with high performance and high strength is essential. Herein, 7-filamentary Cu/Ag composite sheathed Ba0.6K0.4Fe2As2 (Ba122) round wires and tapes were successfully prepared through the ex situ powder-in-tube (PIT) method and treated by hot isostatic pressing (HIP) process. Pure Ba122 phase with roughly homogeneous element distribution was obtained in the superconducting filaments. The wires and tapes show very small low-temperature normal-state resistivity of 0.12 μΩ cm and 0.17 μΩ cm respectively owing to the high electrical conductivity of copper and silver. The HIP process greatly enhances the mass density of the superconducting filaments and promotes the formation of well-grown plate-like Ba122 grains. Vickers hardness measurements on the cross sections of these filaments reveal a rather good uniformity of the mass density. The transport critical current density (Jc) in the 7-filamentary Ba122/Ag/Cu round wires and tapes reached 1.3 × 104 A cm−2 and 4.8 × 104 A cm−2 at 4.2 K in 10 T respectively. These results indicate that hot isostatic pressing is advantageous in developing high-performance multi-filamentary iron-based superconductors.

Original languageEnglish
Article number1353870
JournalPhysica C: Superconductivity and its applications
Volume585
DOIs
Publication statusPublished - 2021 Jun 15

Keywords

  • BaKFeAs
  • Hot isostatic pressing
  • Iron-based superconductors
  • Mass density
  • Multi-filamentary wires and tapes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

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