Enhanced UV imprint ability with a tri-layer stamp configuration

E. Roy, Y. Kanamori, M. Belotti, Y. Chen

Research output: Contribution to journalConference articlepeer-review

24 Citations (Scopus)

Abstract

Soft imprinting lithography enhanced by a UV light (UV-SIL) takes advantages of both nanoimprint and soft lithography. Compared to the related techniques, the UV-SIL process uses single or multi-layer soft stamps and works at room temperature under low pressure (<0.5 bar). The advantage of using soft stamps relies on its conformable patterning over a large wafer area. In addition, the optical transparency of the stamps and the room temperature and low pressure imprint conditions make a high precision alignment achievable and the whole UV-SIL process compatible to the requirement of high-throughput production. In this work, we describe our recent achievements on the stamp fabrication, high resolution and large area imprinting. In particular, we demonstrate a reliable lift-off process which can be used for a wide range of applications.

Original languageEnglish
Pages (from-to)689-694
Number of pages6
JournalMicroelectronic Engineering
Volume78-79
Issue number1-4
DOIs
Publication statusPublished - 2005 Mar
Externally publishedYes
EventProceedings of the 30th International Conference on Micro- and Nano-Engineering -
Duration: 2004 Sep 192004 Sep 22

Keywords

  • Nanofabrication
  • Nanoimprint
  • Pattern transfer
  • Soft lithography

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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