Enhanced UV imprint ability with a tri-layer stamp configuration

E. Roy; Y. Kanamori; M. Belotti; Y. Chen

doi:10.1016/j.mee.2004.12.086

Enhanced UV imprint ability with a tri-layer stamp configuration

E. Roy, Y. Kanamori, M. Belotti, Y. Chen

Research output: Contribution to journal › Conference article › peer-review

24 Citations (Scopus)

Abstract

Soft imprinting lithography enhanced by a UV light (UV-SIL) takes advantages of both nanoimprint and soft lithography. Compared to the related techniques, the UV-SIL process uses single or multi-layer soft stamps and works at room temperature under low pressure (<0.5 bar). The advantage of using soft stamps relies on its conformable patterning over a large wafer area. In addition, the optical transparency of the stamps and the room temperature and low pressure imprint conditions make a high precision alignment achievable and the whole UV-SIL process compatible to the requirement of high-throughput production. In this work, we describe our recent achievements on the stamp fabrication, high resolution and large area imprinting. In particular, we demonstrate a reliable lift-off process which can be used for a wide range of applications.

Original language	English
Pages (from-to)	689-694
Number of pages	6
Journal	Microelectronic Engineering
Volume	78-79
Issue number	1-4
DOIs	https://doi.org/10.1016/j.mee.2004.12.086
Publication status	Published - 2005 Mar
Externally published	Yes
Event	Proceedings of the 30th International Conference on Micro- and Nano-Engineering - Duration: 2004 Sep 19 → 2004 Sep 22

Keywords

Nanofabrication
Nanoimprint
Pattern transfer
Soft lithography

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

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10.1016/j.mee.2004.12.086

Cite this

@article{2c6f45719e274f4db855c77e0ae07a93,

title = "Enhanced UV imprint ability with a tri-layer stamp configuration",

abstract = "Soft imprinting lithography enhanced by a UV light (UV-SIL) takes advantages of both nanoimprint and soft lithography. Compared to the related techniques, the UV-SIL process uses single or multi-layer soft stamps and works at room temperature under low pressure (<0.5 bar). The advantage of using soft stamps relies on its conformable patterning over a large wafer area. In addition, the optical transparency of the stamps and the room temperature and low pressure imprint conditions make a high precision alignment achievable and the whole UV-SIL process compatible to the requirement of high-throughput production. In this work, we describe our recent achievements on the stamp fabrication, high resolution and large area imprinting. In particular, we demonstrate a reliable lift-off process which can be used for a wide range of applications.",

keywords = "Nanofabrication, Nanoimprint, Pattern transfer, Soft lithography",

author = "E. Roy and Y. Kanamori and M. Belotti and Y. Chen",

note = "Funding Information: This work is supported the European Commission through IST Project No. 2001-37472 (Souvenir). The authors thank partners from AMO company (Aachen-Germany) and EVG tool provider (Schaerding-Austria) for useful discussion and collaborations.; Proceedings of the 30th International Conference on Micro- and Nano-Engineering ; Conference date: 19-09-2004 Through 22-09-2004",

year = "2005",

month = mar,

doi = "10.1016/j.mee.2004.12.086",

language = "English",

volume = "78-79",

pages = "689--694",

journal = "Microelectronic Engineering",

issn = "0167-9317",

publisher = "Elsevier",

number = "1-4",

}

TY - JOUR

T1 - Enhanced UV imprint ability with a tri-layer stamp configuration

AU - Roy, E.

AU - Kanamori, Y.

AU - Belotti, M.

AU - Chen, Y.

N1 - Funding Information: This work is supported the European Commission through IST Project No. 2001-37472 (Souvenir). The authors thank partners from AMO company (Aachen-Germany) and EVG tool provider (Schaerding-Austria) for useful discussion and collaborations.

PY - 2005/3

Y1 - 2005/3

N2 - Soft imprinting lithography enhanced by a UV light (UV-SIL) takes advantages of both nanoimprint and soft lithography. Compared to the related techniques, the UV-SIL process uses single or multi-layer soft stamps and works at room temperature under low pressure (<0.5 bar). The advantage of using soft stamps relies on its conformable patterning over a large wafer area. In addition, the optical transparency of the stamps and the room temperature and low pressure imprint conditions make a high precision alignment achievable and the whole UV-SIL process compatible to the requirement of high-throughput production. In this work, we describe our recent achievements on the stamp fabrication, high resolution and large area imprinting. In particular, we demonstrate a reliable lift-off process which can be used for a wide range of applications.

AB - Soft imprinting lithography enhanced by a UV light (UV-SIL) takes advantages of both nanoimprint and soft lithography. Compared to the related techniques, the UV-SIL process uses single or multi-layer soft stamps and works at room temperature under low pressure (<0.5 bar). The advantage of using soft stamps relies on its conformable patterning over a large wafer area. In addition, the optical transparency of the stamps and the room temperature and low pressure imprint conditions make a high precision alignment achievable and the whole UV-SIL process compatible to the requirement of high-throughput production. In this work, we describe our recent achievements on the stamp fabrication, high resolution and large area imprinting. In particular, we demonstrate a reliable lift-off process which can be used for a wide range of applications.

KW - Nanofabrication

KW - Nanoimprint

KW - Pattern transfer

KW - Soft lithography

UR - http://www.scopus.com/inward/record.url?scp=14944339226&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=14944339226&partnerID=8YFLogxK

U2 - 10.1016/j.mee.2004.12.086

DO - 10.1016/j.mee.2004.12.086

M3 - Conference article

AN - SCOPUS:14944339226

VL - 78-79

SP - 689

EP - 694

JO - Microelectronic Engineering

JF - Microelectronic Engineering

SN - 0167-9317

IS - 1-4

T2 - Proceedings of the 30th International Conference on Micro- and Nano-Engineering

Y2 - 19 September 2004 through 22 September 2004

ER -

Enhanced UV imprint ability with a tri-layer stamp configuration

Abstract

Keywords

ASJC Scopus subject areas

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