Enhanced tensile ductility and toughness in nanostructured Cu

Y. M. Wang, E. Ma, M. W. Chen

Research output: Contribution to journalArticlepeer-review

255 Citations (Scopus)

Abstract

Pure copper with ultrafine grain sizes and nanoscale subgrain (dislocation) structures was prepared by using severe plastic deformation through cold rolling at subambient temperatures, with or without subsequent recovery annealing. We report coexisting high strength and tensile ductility (large elongation to failure and ductile fracture). Factors leading to the simultaneous strengthening and toughening with increasing cold deformation and microstructural refinement are discussed.

Original languageEnglish
Pages (from-to)2395-2397
Number of pages3
JournalApplied Physics Letters
Volume80
Issue number13
DOIs
Publication statusPublished - 2002 Apr 1
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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