Enhanced tensile ductility and toughness in nanostructured Cu

Y. M. Wang, E. Ma, M. W. Chen

    Research output: Contribution to journalArticlepeer-review

    243 Citations (Scopus)

    Abstract

    Pure copper with ultrafine grain sizes and nanoscale subgrain (dislocation) structures was prepared by using severe plastic deformation through cold rolling at subambient temperatures, with or without subsequent recovery annealing. We report coexisting high strength and tensile ductility (large elongation to failure and ductile fracture). Factors leading to the simultaneous strengthening and toughening with increasing cold deformation and microstructural refinement are discussed.

    Original languageEnglish
    Pages (from-to)2395-2397
    Number of pages3
    JournalApplied Physics Letters
    Volume80
    Issue number13
    DOIs
    Publication statusPublished - 2002 Apr 1

    ASJC Scopus subject areas

    • Physics and Astronomy (miscellaneous)

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