Endpoint detectable plating through femto-laser drilled glass wafers for three-dimentional electric interconnections

Xinghua Li, Takashi Abe, Masayoshi Esashi

Research output: Contribution to conferencePaperpeer-review

2 Citations (Scopus)

Abstract

An endpoint detectable plating process to avoid overelectroplating was proposed and performed in this work. The technology was developed for a fabrication of Pyrex glass wafer with electrical feed-through. Thin film of gold was deposited on the glass wafer prior to a femto-second laser drilling. When a growing metal in the through-holes was contacted to the gold, a resistance between the opposite two electrodes decreases suddenly. Thus the endpoint detection was realized by in situ monitoring of applied voltage at constant current mode. After the endpoint detection, periodic reverse plating was applied to fill the through-holes uniformly. Finally, uniform copper deposition in the through-holes up to 12 aspect ratios was realized by this method.

Original languageEnglish
Pages638-641
Number of pages4
Publication statusPublished - 2003 Jul 23
EventIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan
Duration: 2003 Jan 192003 Jan 23

Other

OtherIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems
CountryJapan
CityKyoto
Period03/1/1903/1/23

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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