Electrorheological response and structure growth of colloidal silica suspensions

Tomoaki Satoh, Tetsuo Ashitaka, Shinya Orihara, Yoshihisa Saimoto, Mikio Konno

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The electrorheological response and structure growth of colloidal silica suspension was studied with in situ measurements of the shear stress, electric conductivity, and dielectric permittivity of the suspension. The measurements were carried out under steady and sweep shears after the application of an electric field of alternative current (100 Hz) using silica particles with a diameter of 630 nm and a water content of 4.5 wt%. The measurements of the conductivity enabled the detection of structure growth formed by particle aggregation and clarified that the development of the particle aggregation enlarged the dielectric permittivity and the shear stress. Hysteretic behavior observed in the electrorheological response was explained by considering structure growth of the particle aggregation. The correlation equation for the shear stress and the dielectric permittivity obtained in our previous work (1) was found to be applicable to the present results.

Original languageEnglish
Pages (from-to)19-23
Number of pages5
JournalJournal of Colloid And Interface Science
Volume234
Issue number1
DOIs
Publication statusPublished - 2001 Feb 1

Keywords

  • Dielectric permittivity
  • Electric resistivity
  • Electrorheology
  • Silica suspension
  • Steady shear
  • Sweep shear

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Biomaterials
  • Surfaces, Coatings and Films
  • Colloid and Surface Chemistry

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