Abstract
In April 2002, Tohoku University, Sendai, Japan, started offering educational programs from the cross-department Internet School of Tohoku University (ISTU). Electronic packaging is one of the pillar subjects of ISTU. The present paper summarizes its curriculum of internet-based electronic packaging education. Following the overall description, the curriculum concerning thermal management of electronic equipment is explained in some detail. The ISTU program is still under development, and some challenges are foreseen. The most visible among them is the need to lower the cost of wide bandwidth communications. The future of internet schooling is discussed.
| Original language | English |
|---|---|
| Title of host publication | Advances in Electronic Packaging 2003 |
| Subtitle of host publication | Volume 1 |
| Pages | 7-10 |
| Number of pages | 4 |
| Publication status | Published - 2003 |
| Event | 2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, United States Duration: 2003 Jul 6 → 2003 Jul 11 |
Publication series
| Name | Advances in Electronic Packaging |
|---|---|
| Volume | 1 |
Other
| Other | 2003 International Electronic Packaging Technical Conference and Exhibition |
|---|---|
| Country | United States |
| City | Haui, HI |
| Period | 03/7/6 → 03/7/11 |
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
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Cite this
Watanabe, R., Nakayama, W., Ishizuka, M., Maruyama, S., & Behnia, M. (2003). Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight. In Advances in Electronic Packaging 2003: Volume 1 (pp. 7-10). (Advances in Electronic Packaging; Vol. 1).