TY - GEN
T1 - Electronic packaging education through Internet
T2 - 2003 International Electronic Packaging Technical Conference and Exhibition
AU - Watanabe, Ryuzo
AU - Nakayama, Wataru
AU - Ishizuka, Masaru
AU - Maruyama, Shigenao
AU - Behnia, Masud
PY - 2003
Y1 - 2003
N2 - In April 2002, Tohoku University, Sendai, Japan, started offering educational programs from the cross-department Internet School of Tohoku University (ISTU). Electronic packaging is one of the pillar subjects of ISTU. The present paper summarizes its curriculum of internet-based electronic packaging education. Following the overall description, the curriculum concerning thermal management of electronic equipment is explained in some detail. The ISTU program is still under development, and some challenges are foreseen. The most visible among them is the need to lower the cost of wide bandwidth communications. The future of internet schooling is discussed.
AB - In April 2002, Tohoku University, Sendai, Japan, started offering educational programs from the cross-department Internet School of Tohoku University (ISTU). Electronic packaging is one of the pillar subjects of ISTU. The present paper summarizes its curriculum of internet-based electronic packaging education. Following the overall description, the curriculum concerning thermal management of electronic equipment is explained in some detail. The ISTU program is still under development, and some challenges are foreseen. The most visible among them is the need to lower the cost of wide bandwidth communications. The future of internet schooling is discussed.
UR - http://www.scopus.com/inward/record.url?scp=1242309833&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1242309833&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:1242309833
SN - 0791836908
T3 - Advances in Electronic Packaging
SP - 7
EP - 10
BT - Advances in Electronic Packaging 2003
Y2 - 6 July 2003 through 11 July 2003
ER -