Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight

Ryuzo Watanabe, Wataru Nakayama, Masaru Ishizuka, Shigenao Maruyama, Masud Behnia

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In April 2002, Tohoku University, Sendai, Japan, started offering educational programs from the cross-department Internet School of Tohoku University (ISTU). Electronic packaging is one of the pillar subjects of ISTU. The present paper summarizes its curriculum of internet-based electronic packaging education. Following the overall description, the curriculum concerning thermal management of electronic equipment is explained in some detail. The ISTU program is still under development, and some challenges are foreseen. The most visible among them is the need to lower the cost of wide bandwidth communications. The future of internet schooling is discussed.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging 2003
Subtitle of host publicationVolume 1
Pages7-10
Number of pages4
Publication statusPublished - 2003
Event2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, United States
Duration: 2003 Jul 62003 Jul 11

Publication series

NameAdvances in Electronic Packaging
Volume1

Other

Other2003 International Electronic Packaging Technical Conference and Exhibition
CountryUnited States
CityHaui, HI
Period03/7/603/7/11

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Watanabe, R., Nakayama, W., Ishizuka, M., Maruyama, S., & Behnia, M. (2003). Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight. In Advances in Electronic Packaging 2003: Volume 1 (pp. 7-10). (Advances in Electronic Packaging; Vol. 1).