Electron microscopy observation of interface in diffusion-bonded copper joint

Airu Wang; Osamu Ohashi; Norio Yamaguchi; Guoqiang Xie; Minghui Song; Kazuo Furuya; Yasuo Higashi; Nobuteru Hitomi

doi:10.1093/jmicro/53.2.157

Electron microscopy observation of interface in diffusion-bonded copper joint

Airu Wang, Osamu Ohashi, Norio Yamaguchi, Guoqiang Xie, Minghui Song, Kazuo Furuya, Yasuo Higashi, Nobuteru Hitomi

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

The microstructure at the interface of diffusion-bonded joints of oxygen-free high-conductivity copper for two kinds of surface conditions, with and without argon ion bombardment treatment, was investigated using scanning and high-resolution transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that argon ion bombardment effectively removed the surface oxide film layer and lowered the height of the surface asperity, so that inclusion formation was decreased and void shrinkage time was shortened at the interface of the bonded copper joints, and the tensile strength of diffusion-bonded copper joints was improved obviously.

Original language	English
Pages (from-to)	157-161
Number of pages	5
Journal	Journal of Electron Microscopy
Volume	53
Issue number	2
DOIs	https://doi.org/10.1093/jmicro/53.2.157
Publication status	Published - 2004
Externally published	Yes

Keywords

Argon ion bombardment
Diffusion bonding
Fractured surface
HRTEM
Interface
SEM

ASJC Scopus subject areas

Instrumentation

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10.1093/jmicro/53.2.157

Cite this

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title = "Electron microscopy observation of interface in diffusion-bonded copper joint",

abstract = "The microstructure at the interface of diffusion-bonded joints of oxygen-free high-conductivity copper for two kinds of surface conditions, with and without argon ion bombardment treatment, was investigated using scanning and high-resolution transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that argon ion bombardment effectively removed the surface oxide film layer and lowered the height of the surface asperity, so that inclusion formation was decreased and void shrinkage time was shortened at the interface of the bonded copper joints, and the tensile strength of diffusion-bonded copper joints was improved obviously.",

keywords = "Argon ion bombardment, Diffusion bonding, Fractured surface, HRTEM, Interface, SEM",

author = "Airu Wang and Osamu Ohashi and Norio Yamaguchi and Guoqiang Xie and Minghui Song and Kazuo Furuya and Yasuo Higashi and Nobuteru Hitomi",

note = "Funding Information: This work was partially supported by the {\textquoteleft}Nanotechnology Support Project{\textquoteright} of the Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan.",

year = "2004",

doi = "10.1093/jmicro/53.2.157",

language = "English",

volume = "53",

pages = "157--161",

journal = "Microscopy (Oxford, England)",

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publisher = "Japanese Society of Microscopy",

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TY - JOUR

T1 - Electron microscopy observation of interface in diffusion-bonded copper joint

AU - Wang, Airu

AU - Ohashi, Osamu

AU - Yamaguchi, Norio

AU - Xie, Guoqiang

AU - Song, Minghui

AU - Furuya, Kazuo

AU - Higashi, Yasuo

AU - Hitomi, Nobuteru

N1 - Funding Information: This work was partially supported by the ‘Nanotechnology Support Project’ of the Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan.

PY - 2004

Y1 - 2004

N2 - The microstructure at the interface of diffusion-bonded joints of oxygen-free high-conductivity copper for two kinds of surface conditions, with and without argon ion bombardment treatment, was investigated using scanning and high-resolution transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that argon ion bombardment effectively removed the surface oxide film layer and lowered the height of the surface asperity, so that inclusion formation was decreased and void shrinkage time was shortened at the interface of the bonded copper joints, and the tensile strength of diffusion-bonded copper joints was improved obviously.

AB - The microstructure at the interface of diffusion-bonded joints of oxygen-free high-conductivity copper for two kinds of surface conditions, with and without argon ion bombardment treatment, was investigated using scanning and high-resolution transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that argon ion bombardment effectively removed the surface oxide film layer and lowered the height of the surface asperity, so that inclusion formation was decreased and void shrinkage time was shortened at the interface of the bonded copper joints, and the tensile strength of diffusion-bonded copper joints was improved obviously.

KW - Argon ion bombardment

KW - Diffusion bonding

KW - Fractured surface

KW - HRTEM

KW - Interface

KW - SEM

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JF - Microscopy (Oxford, England)

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ER -

Electron microscopy observation of interface in diffusion-bonded copper joint

Abstract

Keywords

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