Electron microscopy observation of interface in diffusion-bonded copper joint

Airu Wang, Osamu Ohashi, Norio Yamaguchi, Guoqiang Xie, Minghui Song, Kazuo Furuya, Yasuo Higashi, Nobuteru Hitomi

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


The microstructure at the interface of diffusion-bonded joints of oxygen-free high-conductivity copper for two kinds of surface conditions, with and without argon ion bombardment treatment, was investigated using scanning and high-resolution transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that argon ion bombardment effectively removed the surface oxide film layer and lowered the height of the surface asperity, so that inclusion formation was decreased and void shrinkage time was shortened at the interface of the bonded copper joints, and the tensile strength of diffusion-bonded copper joints was improved obviously.

Original languageEnglish
Pages (from-to)157-161
Number of pages5
JournalJournal of Electron Microscopy
Issue number2
Publication statusPublished - 2004
Externally publishedYes


  • Argon ion bombardment
  • Diffusion bonding
  • Fractured surface
  • Interface
  • SEM

ASJC Scopus subject areas

  • Instrumentation


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