Electron microscopic observation of interfaces of aluminium powder compacts prepared by spark plasma sintering

G. Xie; O. Ohashi; M. Song; K. Mitsuishi; H. Yasuda; K. Furuya; T. Noda

doi:10.1093/jmicro/51.supplement.s149

Electron microscopic observation of interfaces of aluminium powder compacts prepared by spark plasma sintering

G. Xie, O. Ohashi, M. Song, K. Mitsuishi, H. Yasuda, K. Furuya, T. Noda

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

Aluminium (Al) powder compacts prepared with two kinds of sintering parameters in the spark plasma sintering process have similar density but there is a large difference in their electrical resistivity and tensile properties. The interfaces for the compacts with differing properties were investigated by means of scanning and high-resolution transmission electron microscopy. Two types of interfaces between the powder particles, with metal/metal grain bonding and metal/intermediate oxide film layer/metal grain bonding, were observed in compacts for the two sintering conditions. The properties of Al powder compacts were mainly attributed to the behaviour of oxide film between the particles. It was observed that in the compact containing many metal/metal grain bonding interfaces, the electrical resistivity was lower and the tensile properties were better.

Original language	English
Pages (from-to)	S149-S153
Journal	Journal of Electron Microscopy
Volume	51
Issue number	SUPPL.
DOIs	https://doi.org/10.1093/jmicro/51.supplement.s149
Publication status	Published - 2002 Jan 1

Keywords

Al powder compact
Bonding interface
HRTEM
Oxide film
SEM
Spark plasma sintering

ASJC Scopus subject areas

Instrumentation

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abstract = "Aluminium (Al) powder compacts prepared with two kinds of sintering parameters in the spark plasma sintering process have similar density but there is a large difference in their electrical resistivity and tensile properties. The interfaces for the compacts with differing properties were investigated by means of scanning and high-resolution transmission electron microscopy. Two types of interfaces between the powder particles, with metal/metal grain bonding and metal/intermediate oxide film layer/metal grain bonding, were observed in compacts for the two sintering conditions. The properties of Al powder compacts were mainly attributed to the behaviour of oxide film between the particles. It was observed that in the compact containing many metal/metal grain bonding interfaces, the electrical resistivity was lower and the tensile properties were better.",

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AU - Xie, G.

AU - Ohashi, O.

AU - Song, M.

AU - Mitsuishi, K.

AU - Yasuda, H.

AU - Furuya, K.

AU - Noda, T.

PY - 2002/1/1

Y1 - 2002/1/1

N2 - Aluminium (Al) powder compacts prepared with two kinds of sintering parameters in the spark plasma sintering process have similar density but there is a large difference in their electrical resistivity and tensile properties. The interfaces for the compacts with differing properties were investigated by means of scanning and high-resolution transmission electron microscopy. Two types of interfaces between the powder particles, with metal/metal grain bonding and metal/intermediate oxide film layer/metal grain bonding, were observed in compacts for the two sintering conditions. The properties of Al powder compacts were mainly attributed to the behaviour of oxide film between the particles. It was observed that in the compact containing many metal/metal grain bonding interfaces, the electrical resistivity was lower and the tensile properties were better.

AB - Aluminium (Al) powder compacts prepared with two kinds of sintering parameters in the spark plasma sintering process have similar density but there is a large difference in their electrical resistivity and tensile properties. The interfaces for the compacts with differing properties were investigated by means of scanning and high-resolution transmission electron microscopy. Two types of interfaces between the powder particles, with metal/metal grain bonding and metal/intermediate oxide film layer/metal grain bonding, were observed in compacts for the two sintering conditions. The properties of Al powder compacts were mainly attributed to the behaviour of oxide film between the particles. It was observed that in the compact containing many metal/metal grain bonding interfaces, the electrical resistivity was lower and the tensile properties were better.

KW - Al powder compact

KW - Bonding interface

KW - HRTEM

KW - Oxide film

KW - SEM

KW - Spark plasma sintering

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Electron microscopic observation of interfaces of aluminium powder compacts prepared by spark plasma sintering

Abstract

Keywords

ASJC Scopus subject areas

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