Electromechanical response and residual thermal stress of metal-core piezoelectric fiber /Al matrix composites

Yinli Wang, Tetsuro Yanaseko, Hiroki Kurita, Hiroshi Sato, Hiroshi Asanuma, Fumio Narita

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

It is well known that the curing residual stress induced during a fabrication process has a great influence on the performance of piezoelectric composite devices. The purpose of this work was to evaluate the residual thermal stress of lead zirconate titanate piezoelectric fiber aluminum (Al) matrix (piezoelectric fiber/Al) composites generated during fabrication and to understand the effect of the residual thermal stress on the electromechanical response. The three-dimensional finite element method was employed, and the residual stress generated during the solidification process of the Al matrix was calculated. The output voltage was also calculated in the analysis when putting stresses on the composite materials in the length direction of the piezoelectric fiber. It was shown that the cooling from higher temperatures increases the electromechanical conversion capability. Furthermore, we also performed the simulation, and we recorded the output voltage under concentrated load to investigate its application as a load position detection sensor, and we also discussed the influence of the position by changing the modeling with a different fiber position in the Al. The residual stress of hot press molded piezoelectric fiber/Al composite was then measured, and the comparison was made with the calculated values. The simulation results revealed that our model predictions reproduced and explained the experimental observations of curing residual stress. After this study, similar models of composite materials can be analyzed by this simulation, and the result can be used to design piezoelectric composite materials.

Original languageEnglish
Article number5799
Pages (from-to)1-14
Number of pages14
JournalSensors (Switzerland)
Volume20
Issue number20
DOIs
Publication statusPublished - 2020 Oct 2

Keywords

  • Composite materials
  • Finite element simulation
  • Piezoelectricity
  • Residual stress
  • Sensor

ASJC Scopus subject areas

  • Analytical Chemistry
  • Biochemistry
  • Atomic and Molecular Physics, and Optics
  • Instrumentation
  • Electrical and Electronic Engineering

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