Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications

Zhonglie An; Masaya Toda; Takahito Ono

doi:10.1109/MEMSYS.2016.7421678

Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications

Zhonglie An, Masaya Toda, Takahito Ono

ENG - Mechanical Systems Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

In this paper, we present the electrodeposition of copper (Cu) composites with high contents of carbon nanotubes (CNTs), and evaluate the mechanical, electrical and thermal properties of the composites. A novel electroplating method is developed for the electrodeposition of the CNTs-Cu composite with two kinds of multi-walled CNTs (MWCNTs), thermally-annealed at 1200°C and 2600°C. The weight fractions of the CNTs in the composites are 5.0 wt%, and 2.8 wt%, and the Young's moduli of the composites are approximately 1.2 times and 1.1 times greater than that of the Cu film, respectively. The composites exhibit 26% and 16% lower coefficients of thermal expansion (CTE) than that of the Cu, and possess the same electrical resistivity with the Cu. This results show that the CNTs-Cu composite is ideally suited for microelectrical elements applications.

Original language	English
Title of host publication	MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	528-531
Number of pages	4
ISBN (Electronic)	9781509019731
DOIs	https://doi.org/10.1109/MEMSYS.2016.7421678
Publication status	Published - 2016 Feb 26
Event	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China Duration: 2016 Jan 24 → 2016 Jan 28

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume	2016-February
ISSN (Print)	1084-6999

Other

Other	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Country	China
City	Shanghai
Period	16/1/24 → 16/1/28

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

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An, Z., Toda, M., & Ono, T. (2016). Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications. In MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems (pp. 528-531). [7421678] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2016-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2016.7421678

Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications. / An, Zhonglie; Toda, Masaya ; Ono, Takahito.

MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2016. p. 528-531 7421678 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2016-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

An, Z, Toda, M & Ono, T 2016, Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications. in MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems., 7421678, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), vol. 2016-February, Institute of Electrical and Electronics Engineers Inc., pp. 528-531, 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016, Shanghai, China, 16/1/24. https://doi.org/10.1109/MEMSYS.2016.7421678

An Z, Toda M , Ono T. Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications. In MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc. 2016. p. 528-531. 7421678. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2016.7421678

An, Zhonglie ; Toda, Masaya ; Ono, Takahito. / Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications. MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 528-531 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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abstract = "In this paper, we present the electrodeposition of copper (Cu) composites with high contents of carbon nanotubes (CNTs), and evaluate the mechanical, electrical and thermal properties of the composites. A novel electroplating method is developed for the electrodeposition of the CNTs-Cu composite with two kinds of multi-walled CNTs (MWCNTs), thermally-annealed at 1200°C and 2600°C. The weight fractions of the CNTs in the composites are 5.0 wt%, and 2.8 wt%, and the Young's moduli of the composites are approximately 1.2 times and 1.1 times greater than that of the Cu film, respectively. The composites exhibit 26% and 16% lower coefficients of thermal expansion (CTE) than that of the Cu, and possess the same electrical resistivity with the Cu. This results show that the CNTs-Cu composite is ideally suited for microelectrical elements applications.",

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N2 - In this paper, we present the electrodeposition of copper (Cu) composites with high contents of carbon nanotubes (CNTs), and evaluate the mechanical, electrical and thermal properties of the composites. A novel electroplating method is developed for the electrodeposition of the CNTs-Cu composite with two kinds of multi-walled CNTs (MWCNTs), thermally-annealed at 1200°C and 2600°C. The weight fractions of the CNTs in the composites are 5.0 wt%, and 2.8 wt%, and the Young's moduli of the composites are approximately 1.2 times and 1.1 times greater than that of the Cu film, respectively. The composites exhibit 26% and 16% lower coefficients of thermal expansion (CTE) than that of the Cu, and possess the same electrical resistivity with the Cu. This results show that the CNTs-Cu composite is ideally suited for microelectrical elements applications.

AB - In this paper, we present the electrodeposition of copper (Cu) composites with high contents of carbon nanotubes (CNTs), and evaluate the mechanical, electrical and thermal properties of the composites. A novel electroplating method is developed for the electrodeposition of the CNTs-Cu composite with two kinds of multi-walled CNTs (MWCNTs), thermally-annealed at 1200°C and 2600°C. The weight fractions of the CNTs in the composites are 5.0 wt%, and 2.8 wt%, and the Young's moduli of the composites are approximately 1.2 times and 1.1 times greater than that of the Cu film, respectively. The composites exhibit 26% and 16% lower coefficients of thermal expansion (CTE) than that of the Cu, and possess the same electrical resistivity with the Cu. This results show that the CNTs-Cu composite is ideally suited for microelectrical elements applications.

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Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications

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