Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this paper, we present the electrodeposition of copper (Cu) composites with high contents of carbon nanotubes (CNTs), and evaluate the mechanical, electrical and thermal properties of the composites. A novel electroplating method is developed for the electrodeposition of the CNTs-Cu composite with two kinds of multi-walled CNTs (MWCNTs), thermally-annealed at 1200°C and 2600°C. The weight fractions of the CNTs in the composites are 5.0 wt%, and 2.8 wt%, and the Young's moduli of the composites are approximately 1.2 times and 1.1 times greater than that of the Cu film, respectively. The composites exhibit 26% and 16% lower coefficients of thermal expansion (CTE) than that of the Cu, and possess the same electrical resistivity with the Cu. This results show that the CNTs-Cu composite is ideally suited for microelectrical elements applications.

Original languageEnglish
Title of host publicationMEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages528-531
Number of pages4
ISBN (Electronic)9781509019731
DOIs
Publication statusPublished - 2016 Feb 26
Event29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China
Duration: 2016 Jan 242016 Jan 28

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2016-February
ISSN (Print)1084-6999

Other

Other29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
CountryChina
CityShanghai
Period16/1/2416/1/28

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Electrodeposition of carbon nanotubes-Cu composite for microelectrical elements applications'. Together they form a unique fingerprint.

Cite this