Electrode joining method by coating Sn/Mo layer on N-type thermoelectric element

Takehiko Sato, Kazuo Kamada, Yoshimitsu Nakamura

Research output: Contribution to journalArticlepeer-review

Abstract

This paper proposes a new joining method of n-type thermoelectric element (Bi2Te2.85e5Se0.15). The paper says that the bonding strength can be enhanced by coating Sn/Mo layer on the thermoelectric element. In case that a diffusion barrier material is coated directly on the thermoelectric element, the bonding strength is very weak. However, it shows high bonding strength when Sn alloy layer is formed. Additionally, the result of the reliable test clarified that Sn alloy layer does not adversely affect the performance of thermoelectric element. The reliable test conducted includes heat cycle test, heating test and cooling performance test. These results show the Sn/Mo layer coating method is very effective in joining electrode to thermoelectric element.

Original languageEnglish
Pages (from-to)180-183
Number of pages4
JournalNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Volume66
Issue number641
DOIs
Publication statusPublished - 2000

Keywords

  • Bonding strength
  • Coating
  • Diffusion barrier layer
  • Electrode joining
  • Interlaminar shear
  • Laminated construction
  • Molybdenum
  • Reliability
  • Thermoelectric element
  • Tin alloy

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Electrode joining method by coating Sn/Mo layer on N-type thermoelectric element'. Together they form a unique fingerprint.

Cite this